Electronic Package Frame With Metal Layer For Heat And EMI
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Solution Overview
Problem
Current electronic component packages face challenges in achieving compact size, efficient heat dissipation, and electromagnetic interference (EMI) protection while maintaining design flexibility and space utilization, particularly in miniaturized electronic devices.
Innovation Solution
The electronic component package incorporates a frame with through holes, an encapsulant, a metal layer, and redistribution layers, where the metal layer contacts the encapsulant and wiring layers to serve as a ground, improving heat radiation and EMI shielding, and features connection terminals for efficient electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a compact package design is implemented, then the package size is reduced, but heat dissipation becomes insufficient
Solution Approach 1:
The patent introduces a metal layer extending in the thickness direction (vertical dimension) from the encapsulant surface, transforming the heat dissipation approach from horizontal spreading to vertical radiation. This dimensional change allows heat to be radiated upward through the metal layer without increasing the package's planar footprint, thus resolving the contradiction between compact size and heat dissipation capability
Solution Approach 2:
The metal layer is strategically positioned only at specific locations where heat dissipation is needed, rather than uniformly distributed throughout the package. This localized structure optimizes heat radiation efficiency while minimizing the space occupied, allowing the package to maintain compact dimensions while achieving effective thermal management
2Object-affected harmful factors
If shielding structures are added for EMI protection, then EMI resistance is improved, but device complexity increases
Solution Approach 1:
The metal layer serves multiple functions simultaneously: it acts as a heat radiation element for thermal management and as an EMI shielding structure for electromagnetic protection. By combining these functions into a single component, the patent achieves both heat dissipation and EMI resistance without proportionally increasing structural complexity
Solution Approach 2:
The patent merges the heat dissipation function and EMI shielding function into a single integrated metal layer structure. This consolidation eliminates the need for separate heat sinks and EMI shields, reducing overall device complexity while maintaining both thermal and electromagnetic performance
3Length of stationary object
If the package thickness is reduced, then miniaturization is achieved, but design freedom is limited
Solution Approach 1:
The metal layer extends in the thickness direction, utilizing the vertical dimension for heat dissipation and EMI shielding functions. This allows the package to maintain reduced thickness in the planar dimensions while effectively using the thickness direction for functional performance, thereby achieving miniaturization without compromising design freedom
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat radiation efficiency, reduces the package thickness, and improves design freedom by integrating the metal layer directly with the encapsulant and wiring layers, effectively addressing the challenges of compact size, heat dissipation, and EMI protection.
Implementation Method 1
improving heat radiation
Implementation Method 2
EMI shielding
Data Source
AI summary
An electronic component package includes a frame, an electronic component, an encapsulant, a metal layer, and a redistribution layer. The frame has a through hole. The electronic component is disposed in the through hole of the frame and has an active surface on which electrode pads are formed and an inactive surface opposing the active surface. The encapsulant covers the inactive surface of the electronic component and is disposed between the frame and the electronic component within the through hole. The metal layer is formed on a surface of the encapsulant. The redistribution layer is disposed adjacently to the active surface of the electronic component and electrically connected to the electrode pads.