Built-in 3D Metal Shielding Case for Package EMI Reduction
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Solution Overview
Problem
Conventional metal shielding cases for integrated circuits require customization to fit different device sizes, leading to increased manufacturing costs due to the need for multiple designs and the stamping process, which is inefficient for reducing Electro-Magnetic Interference (EMI) in high-frequency applications.
Innovation Solution
A built-in metal shielding case is formed during the packaging process using a copper foil or other conductive materials, with conductive posts and redistribution lines to create a 3D shielding structure that encloses device dies, reducing EMI without the need for separate shielding cases and minimizing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional metal shielding cases are used to shield device dies, then EMI between device dies is reduced, but manufacturing cost increases due to customization requirements for different die sizes and shapes
Solution Approach 1:
The patent applies universality by designing a single standardized metal shielding case structure that can accommodate multiple die sizes and shapes. The shielding case is configured with a universal mounting structure that allows it to shield different device dies without requiring custom design for each die, thereby reducing manufacturing cost while maintaining EMI reduction effectiveness.
Solution Approach 2:
The patent applies segmentation by dividing the shielding case into modular components that can be selectively assembled or configured for different die sizes. The shielding structure includes separable elements such as side walls, bottom walls, and mounting features that can be adapted to fit various die dimensions without requiring complete redesign of the entire shielding case.
2Object-affected harmful factors
If multiple customized metal shielding cases are designed for different die sizes, then EMI shielding effectiveness is maintained, but device complexity increases
Solution Approach 1:
The patent applies universality by creating a single multi-functional shielding case design that can serve multiple die sizes and shapes. This universal design eliminates the need for multiple specialized shielding cases, thereby reducing device complexity while maintaining effective EMI shielding through its adaptable configuration.
3Object-affected harmful factors
If metal shielding cases are customized for each die size and shape, then precise shielding coverage is achieved, but productivity decreases due to increased manufacturing steps
Solution Approach 1:
The patent applies universality by designing a standardized shielding case that can accommodate multiple die sizes and shapes without requiring custom manufacturing for each die. This universal design maintains precise shielding coverage through its adaptable structure while significantly improving productivity by eliminating the need for multiple customization steps in the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces EMI between device dies and external devices while lowering manufacturing costs by integrating the shielding structure within the packaging process, forming a 3D metal shielding case that is more efficient and cost-effective than conventional methods.
Implementation Method 1
A built-in metal shielding case is formed during the packaging process using a copper foil or other conductive materials... reducing EMI without the need for separate shielding cases
Data Source
AI summary
A package includes a device die, a molding material molding the device die therein, and a through-via penetrating through the molding material. A redistribution line is on a side of the molding material. The redistribution line is electrically coupled to the through-via. A metal ring is close to edges of the package, wherein the metal ring is coplanar with the redistribution line.