Integrated Device Package Metallization for Heat and Power Delivery

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Solution Overview

Problem

There is an ongoing need for improved electrical packages that provide better performance and reduced size, while also requiring better thermal management and efficient power delivery.

Innovation Solution

A package comprising a base portion with base interconnects, integrated devices, a fill material, and a metallization portion, which includes inorganic materials for improved thermal performance and fine pitch connections, along with a fabrication process that integrates different technology nodes for cost-effective production.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional packaging structures are used, then manufacturing simplicity is maintained, but thermal performance deteriorates

Engineering Contradiction:

Improvethermal performanceVSAvoidpackage structure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent employs a composite packaging structure consisting of a molded carrier with integrated metal interconnects, ceramic or organic substrates, and encapsulating materials. This multi-material approach optimizes thermal conductivity pathways while maintaining structural integrity, directly addressing the thermal performance improvement without excessive complexity

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The package is divided into distinct functional segments: a molded carrier for mechanical support and routing, separate integrated circuits or devices, interconnect structures for electrical coupling, and encapsulating materials for protection. This segmentation allows each component to be optimized for its specific function, including thermal management, while enabling modular manufacturing

Inventive Principle:

Principle #1Segmentation

2Volume of moving object

If package size is reduced, then integration density improves, but manufacturing precision requirements increase

Engineering Contradiction:

Improvepackage sizeVSAvoidfabrication precision

Core Design Contradiction:

Volume of moving objectVSManufacturing precision

Solution Approach 1:

The patent implements nested packaging where integrated circuits, passive components, and interconnect structures are arranged in multiple layers and embedded within the molded carrier. Devices are positioned in recesses or mounted on elevated surfaces, allowing three-dimensional utilization of package volume. This nesting approach reduces the overall package footprint while maintaining adequate spacing and alignment through the molded carrier's integrated features

Inventive Principle:

Principle #7Nested doll (Nesting)

Solution Approach 2:

Multiple functional elements are merged into integrated structures: the molded carrier combines mechanical support, electrical routing pathways, and component positioning features; interconnects integrate electrical, mechanical, and thermal functions; encapsulating materials provide both protection and structural support. This merging reduces the number of discrete components and assembly steps, thereby reducing overall package size while managing manufacturing complexity

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If advanced packaging techniques are used, then performance improves, but fabrication cost increases

Engineering Contradiction:

Improveelectrical performanceVSAvoidfabrication cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The molded carrier is fabricated with pre-formed interconnect pathways, routing channels, and component positioning features before devices are mounted. Electrical pathways and mechanical structures are created in advance during the molding process, eliminating subsequent complex assembly steps. This preliminary action enables advanced packaging functionality while simplifying the overall manufacturing process and reducing costs

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The molded carrier serves multiple functions simultaneously: mechanical support for devices, electrical routing through integrated pathways, thermal conduction via metal traces, and protection through encapsulation. The encapsulating material provides both environmental protection and structural support. This multi-functionality reduces the number of separate components needed, simplifying manufacturing while achieving advanced packaging performance

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS20250273586A1Package comprising a base portion and integrated devices

Publication Date: 2025.08.28 QUALCOMM INC

AI summary

A package comprising a base portion comprising a plurality of base interconnects; a first integrated device coupled to the base portion; a second integrated device coupled to the base portion; a fill material coupled to the base portion, the first integrated device and the second integrated device; and a metallization portion coupled to the first integrated device and the second integrated device.