Electronic Package Qualification Using Mimic Dies for Board Reliability
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Solution Overview
Problem
Existing methods for developing electronic device packages struggle with ensuring board level reliability (BLR) testing, often requiring multiple redesigns and lengthy testing processes, which delays time to market and increases costs.
Innovation Solution
The use of product mimic dies, which replicate the size, shape, and connections of the actual product die, allows for the development and validation of the product package in parallel with the product die development. These mimic dies are used to perform BLR testing, enabling the identification and correction of potential failures before the actual product die is completed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional sequential development methods are used for electronic device packages, then the actual product die can be fully developed and tested, but the time to market increases and multiple redesigns are required
Solution Approach 1:
The patent applies preliminary action by creating and testing a package prototype using a mimic die before the actual product die is fully developed. This allows the package design, assembly process, and board level reliability testing to be completed in advance, so that when the actual product die is ready, it can be immediately packaged and marketed without delays for redesign or retesting.
2Manufacturing precision
If package development waits for actual product die completion, then testing can be performed on the real device, but multiple redesigns and lengthy testing processes delay time to market
Solution Approach 1:
The patent uses a mimic die that replicates the physical and electrical characteristics of the actual product die. This copy allows the package to be assembled, tested, and validated with the same manufacturing processes and assembly accuracy requirements as the final product, enabling parallel development without compromising manufacturing precision while significantly accelerating the development timeline.
3Reliability
If reliability testing is performed iteratively with redesigns, then board level reliability can be achieved, but costs increase due to repeated modifications
Solution Approach 1:
By performing board level reliability testing in advance using the mimic die and package prototype, all necessary redesigns and optimizations are completed before actual product production begins. This preliminary validation eliminates the need for costly iterative modifications after manufacturing starts, reducing overall development costs while ensuring reliability requirements are met.
Data Source
AI summary
In a described example, a method includes: providing a product package for a product die; building a product mimic die that mimics the product die and which is configured to make the product package functional for use in reliability testing; packaging the product mimic die in the product package to form a packaged product mimic die; reliability testing the packaged product mimic die; responsive to the reliability testing, revising the product package; and repeating the steps of reliability testing and revising the product package until the product package passes the reliability tests.