Package Module Frame Gap Encapsulant Height
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Solution Overview
Problem
In power electronic device packaging, excess encapsulant thickness is often required due to height differences among components, leading to unnecessary cost and inefficiency.
Innovation Solution
A package module design where a frame is positioned next to an electronic component to create a gap, allowing the encapsulant to be thicker locally, reducing overall encapsulant amount by having a first portion covering the circuit board and a second portion filling the gap, which is taller than the first portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If protective encapsulant is filled to cover height differences among electronic components, then electrical isolation and protection are ensured, but excess encapsulant thickness is required leading to unnecessary cost
Solution Approach 1:
The frame introduces local quality variation in the encapsulant structure by creating a stepped configuration where the encapsulant height differs in different regions. The first portion has height H1 covering the circuit board, while the second portion has height H2 filling the gap between frame and component, with H2 > H1. This localized height differentiation ensures adequate protection and electrical isolation only where needed, reducing overall encapsulant consumption.
Solution Approach 2:
The encapsulant is segmented into two distinct portions by the frame structure: a first portion covering the circuit board and a second portion filling the gap between the frame and electronic component. This segmentation allows each portion to be optimized independently for its specific function, with the second portion providing enhanced protection where the component protrudes while the first portion provides baseline coverage, thereby reducing total material usage.
2Ease of manufacture
If uniform encapsulant thickness is used across the entire package, then manufacturing is simplified, but excess encapsulant is used around lower components increasing cost
Solution Approach 1:
The frame creates local quality differentiation in the encapsulant distribution by establishing two distinct height regions. The first portion has height H1 suitable for covering the circuit board and lower components, while the second portion has increased height H2 to fill the gap and protect the protruding electronic component. This localized variation optimizes material usage without complicating the overall injection molding process.
3Reliability
If more encapsulant is used to ensure adequate protection of all components, then reliability improves, but cost increases due to unnecessary material usage
Solution Approach 1:
The frame structure implements local quality optimization by creating a stepped encapsulant configuration where protection level is matched to component height requirements. The second portion with height H2 provides enhanced protection for the electronic component that protrudes above the circuit board level, while the first portion with height H1 provides adequate baseline protection for lower components, ensuring reliability is optimized locally rather than uniformly across all components.
Solution Approach 2:
The frame creates a stepped pattern that copies the height profile of the electronic component, with the second portion of encapsulant matching the protrusion height of the component. This copying approach ensures that encapsulant is provided in precisely the amount needed to match the component geometry, avoiding both deficiency and excess.
Data Source
AI summary
A package module includes a circuit board, an electronic component disposed on the circuit board, a frame disposed next to at least one side of the electronic component, and an encapsulant. A gap is formed between the frame and the electronic component. The encapsulant includes a first portion covering at least a part of the circuit board, and a second portion filling into at least a part of the gap. The first portion has a first height relative to the circuit board, and the second portion has a second height relative to the circuit board, in which the second height is greater than the first height.