Electronic Package Module Structure for Thin RDL Singulation
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Solution Overview
Problem
Ultra-thin redistribution layer (RDL) substrates are prone to damage during the singulation process and have weak adhesion with molding compounds, leading to yield loss and reduced reliability of electronic products.
Innovation Solution
The electronic package module design includes a circuit substrate with insulation layers and trenches, where the molding compound directly touches the inner surfaces of the trenches and the boundary surfaces, enhancing adhesion and protecting the substrate during cutting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If ultra-thin RDL substrate is used to reduce device thickness, then device thickness is reduced, but the substrate becomes prone to damage during singulation process
Solution Approach 1:
A carrier substrate is provided beforehand to support the ultra-thin RDL substrate during the singulation process. The carrier substrate acts as a cushioning layer that prevents the thin substrate from breaking during cutting operations, allowing the final device to achieve thinness while maintaining reliability during manufacturing.
Solution Approach 2:
The carrier substrate serves as an intermediary between the cutting tool and the ultra-thin RDL substrate. It mediates the mechanical stress during singulation, absorbing the impact and preventing direct damage to the fragile thin substrate. After singulation, the carrier can be removed or retained depending on the design requirements.
2Length of moving object
If ultra-thin RDL substrate is used to reduce device thickness, then device thickness is reduced, but adhesion with molding compound becomes weak
Solution Approach 1:
The carrier substrate provides beforehand support to the ultra-thin RDL substrate, enabling proper adhesion between the substrate and molding compound. By maintaining structural integrity during the bonding process, the carrier ensures that the thin substrate can achieve adequate adhesion strength without compromising its thickness advantage.
Solution Approach 2:
The structure forms a composite system comprising the ultra-thin RDL substrate, carrier substrate, and molding compound. This composite approach allows each layer to contribute its specific properties: the thin substrate provides the desired thinness, the carrier provides mechanical strength and adhesion during processing, and the molding compound provides encapsulation and additional structural support.
3Reliability
If RDL substrate is damaged during singulation, then manufacturing yield is reduced, but increasing substrate thickness can prevent damage
Solution Approach 1:
The carrier substrate provides beforehand protection during singulation, preventing damage to the RDL substrate. This allows the manufacturing process to proceed with high yield while maintaining substrate integrity, as the carrier absorbs the mechanical stress of cutting without transmitting it to the fragile thin substrate.
Solution Approach 2:
The carrier substrate acts as an intermediary that enables the singulation process to occur without damaging the RDL substrate. It mediates between the cutting tool and the substrate, allowing high-speed manufacturing with maintained yield by protecting the substrate during the critical cutting operation.
4Strength
If adhesion between substrate and molding compound is weak, then structural strength is insufficient, but increasing adhesion may require complex surface treatment
Solution Approach 1:
The composite structure of carrier substrate plus molding compound provides inherent structural strength without requiring complex surface treatments on the ultra-thin RDL substrate. The carrier substrate serves as an adhesion layer that bonds well with the molding compound, achieving adequate structural strength through material selection rather than surface complexity.
Solution Approach 2:
The carrier substrate inherently provides the adhesion function needed for bonding with the molding compound. Rather than requiring additional surface treatment layers or complex modifications to the thin substrate, the carrier substrate self-performs the adhesion role, simplifying the overall structure while maintaining structural strength.
Data Source
AI summary
An electronic package module including a circuit substrate, an electronic component disposed on the circuit substrate and a molding compound is provided. The molding compound encapsulates the circuit substrate and the electronic component. The circuit substrate includes a first circuit layer and a first insulation layer covering on the first circuit layer. The first insulation layer has a boundary surface where a second circuit layer is disposed. A second insulation layer covers a part of the second circuit layer while the insulation layer bares a region surrounding the perimeter of the boundary surface. The molding compound directly contacts the region and the second insulation layer.