Semiconductor Package Module Layout for Dense Thin Integration
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Solution Overview
Problem
Current semiconductor package technologies, such as fan-in and fan-out packages, face limitations in accommodating a large number of semiconductor chips and electronic components, leading to spatial constraints and difficulties in direct mounting on mainboards, especially due to increased I/O terminals and component size requirements.
Innovation Solution
A novel package module design that includes redistribution layers, semiconductor chips, electronic components, and frames, with encapsulants covering these components, allowing for a heterogeneous outer surface and modularization to increase integration density and prevent undulation or component shift, thereby enhancing yield and enabling miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple semiconductor chips and electronic components are mounted in one package, then integration density increases, but package thickness increases and mounting becomes difficult
Solution Approach 1:
The patent transitions from vertical stacking (increasing thickness) to horizontal integration (increasing area utilization). Multiple semiconductor chips and electronic components are arranged in a planar configuration on the package substrate, allowing high integration density without increasing package thickness. This dimensional shift enables mounting on mainboards while accommodating numerous components.
2Area of stationary object
If package size is reduced for miniaturization, then mounting area decreases, but component placement and heat dissipation become more difficult
Solution Approach 1:
The package is segmented into functional zones: an active area for mounting semiconductor chips with precise alignment features, a peripheral area for electronic components, and dedicated thermal management zones. This segmentation allows optimized placement precision in the active area while maintaining adequate spacing for heat dissipation in peripheral areas, even within a compact overall footprint.
3Adaptability or versatility
If more I/O terminals are integrated, then functionality increases, but package complexity and manufacturing difficulty increase
Solution Approach 1:
The package substrate serves multiple functions simultaneously: it provides mechanical support for mounting, electrical interconnection through redistribution layers, thermal management pathways, and alignment reference structures. This multi-functionality enables high I/O terminal integration without proportionally increasing package complexity, as a single structural element fulfills multiple roles.
4Quantity of substance
If components are densely packed, then integration density increases, but risk of component shift and undulation increases
Solution Approach 1:
Alignment reference structures and positioning features are pre-formed on the package substrate before component mounting. These preliminary structures include alignment marks, recesses, and mechanical stops that guide and constrain component placement. This preliminary action ensures precise positioning and prevents component shift during subsequent assembly and handling processes, even when components are densely packed.
Data Source
AI summary
A package module includes a connection structure including one or more redistribution layers, a semiconductor chip disposed on the connection structure and having a connection pad electrically connected to the one or more redistribution layers, a plurality of electronic components disposed on the connection structure and electrically connected to the one or more redistribution layers, one or more frames disposed on the connection structure, and an encapsulant disposed on the connection structure, and respectively covering at least portions of the semiconductor chip, the plurality of electronic components, and the one or more frames. At least a portion of an outer side surface of the encapsulant is coplanar on the same level as at least a portion of an outer side surface of at least one of the one or more frames.