Semiconductor Package Mold Pressure Balancing for Warp Prevention
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Solution Overview
Problem
The warping and damage of plastic package substrates during semiconductor package injection molding due to high pressure, especially when the lower surface has grooves or cavities, leading to potential chip damage and substrate fracture, is addressed by designing customized bottom molds with convex structures, which are costly and time-consuming.
Innovation Solution
A semiconductor package injection molding mold with a bottom mold featuring through holes connected to a pressure source, balancing pressure on the upper and lower surfaces of the substrate during injection molding, eliminating the need for customized molds and reducing production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If customized bottom molds with convex structures are designed for different plastic package substrates, then substrate warping and chip damage are prevented, but manufacturing cost and delivery time increase significantly
Solution Approach 1:
The invention designs a universal bottom mold structure with adjustable support elements that can adapt to different substrate types and groove configurations. Instead of creating customized molds for each substrate, the same mold can be reconfigured to support various substrate geometries, thereby preventing warping and chip damage while maintaining cost-effectiveness and reducing delivery time.
Solution Approach 2:
The bottom mold incorporates adjustable and movable support elements that can be repositioned according to the specific groove locations and cavity depths of different substrates. This dynamic adjustability allows the mold to provide precise support where needed without requiring a completely new mold design for each substrate variant, thus resolving the contradiction between reliability and ease of manufacture.
2Reliability
If customized bottom molds with convex structures are designed for different plastic package substrates, then substrate warping and chip damage are prevented, but delivery time is prolonged
Solution Approach 1:
The universal bottom mold design allows a single mold to serve multiple substrate types by adjusting support element positions and configurations. This eliminates the need to manufacture and deliver different customized molds for each substrate, significantly reducing delivery time while maintaining the ability to prevent substrate warping and chip damage through proper support.
Solution Approach 2:
The bottom mold is pre-equipped with adjustable support mechanisms that can be quickly reconfigured for different substrate types. This preliminary preparation of the mold structure enables rapid adaptation to various substrate geometries without requiring time-consuming custom mold fabrication, thus resolving the contradiction between reliability and delivery time.
3Ease of manufacture
If current bottom mold processing technology is used, then manufacturing cost is reduced, but manufacturing precision is limited and cavities remain between the bottom mold and substrate
Solution Approach 1:
The invention employs adjustable support elements that can be precisely repositioned to match the specific groove locations and cavity depths of different substrates. This dynamic adjustment capability allows the mold to achieve high fitting accuracy without requiring expensive high-precision machining, thus resolving the contradiction between ease of manufacture and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents substrate warping and chip damage by adjusting pressure distribution, reducing costs and delivery time through the use of a universal bottom mold compatible with various substrates.
Implementation Method 1
the pressure on the lower surface of the substrate generated by the pressure source is used to balance the pressure on the upper surface of the substrate during injection molding
Data Source
AI summary
The present invention relates to the technical field of chip package, in particular to a semiconductor package injection molding mold, a semiconductor package injection molding device and a semiconductor package injection molding method. The semiconductor package injection molding mold includes a bottom mold and a top mold. The upper surface of the bottom mold is fitted with the lower surface of a substrate to form a semiconductor package structure; the top mold is matched with the bottom mold; the top mold has a cavity; the cavity is oriented toward the upper surface of the substrate and is used to accommodate a plastic package layer formed on the upper surface of the substrate; through holes that penetrate through the bottom mold are formed at positions corresponding to the substrate in the bottom mold; and the through holes are connected with an external pressure source.