Electronic Package Molding Support to Prevent Die Pad Flash
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Solution Overview
Problem
Existing electronic package manufacturing methods often result in thick flashes of molding compound forming under die pads and package contacts, which can obstruct terminal functionality and reduce the effectiveness of die pads as heatsinks.
Innovation Solution
The introduction of a first conductive mechanical support, such as a clip lead, which is used to press down the frame during the molding process, preventing the formation of thick flashes by mechanically engaging the second mold portion and limiting the flow of molding compound.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If molding compound is injected into the molding cavity to encapsulate semiconductor dies, then the semiconductor dies are protected by encapsulation, but thick flashes of molding compound form under die pads and package contacts, obstructing terminal functionality and reducing heatsink effectiveness
Solution Approach 1:
The patent applies preliminary action by positioning the frame at a predetermined position within the molding cavity before injection molding begins. This predetermined positioning ensures that the frame is correctly located to prevent flash formation under critical areas (die pads and package contacts) before the molding compound is injected, thereby solving the flash control problem while maintaining encapsulation protection
Solution Approach 2:
The patent introduces an intermediary element (the frame positioned at a predetermined position) that acts as a mediator between the molding compound and the critical components. This frame serves as a physical barrier that redirects or limits the flow of molding compound, preventing it from forming thick flashes under die pads and package contacts while still allowing proper encapsulation of the semiconductor dies
2Reliability
If package material flows freely during molding, then complete encapsulation of semiconductor dies is achieved, but thick flashes form that obstruct terminal access and reduce heatsink performance
Solution Approach 1:
The frame is positioned at a predetermined position before molding to preemptively control material flow paths. This preliminary positioning ensures that while molding compound can freely flow to achieve complete encapsulation, it is guided away from critical terminal areas, preventing obstructive flash formation and maintaining terminal accessibility
Solution Approach 2:
The patent applies local quality by creating different flow characteristics in different regions of the molding cavity. The frame positioned at a predetermined position creates localized flow restrictions in critical areas (under die pads and package contacts) while allowing free flow in non-critical areas, achieving complete encapsulation without obstructive flashes at terminal locations
Data Source
AI summary
An electronic package and method for manufacturing the same is provided. The method includes providing a frame with die pads, each pad having a semiconductor die that have a first electrical contact on a first side of the die facing and electrically contacting the pad, and a second electrical contact on a second side of the die opposite to the first side, providing a first conductive mechanical support connected to the pad and/or a second conductive mechanical support connected to the second electrical contact, and providing a mold including a first mold portion which the frame is on, and a second mold portion in contact with the frame opposite to the first mold portion, forming a cavity around the dies, the second mold portion contacts at least one of the first conductive mechanical support and the second conductive mechanical support, while applying the molding compound and allowing it to solidify.