Electronic Package Molding with Planar Heating and Gas Pressure Control
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Solution Overview
Problem
Current electronic package molding technologies, such as transfer and compression molding, face challenges with material and energy wastage, high production costs, and reduced production rates due to the need for expensive and time-consuming hot press process equipment, which limits the size of the packages and increases prices.
Innovation Solution
An electronic package molding device utilizing a planar heating element to melt and apply pressure to an epoxy molding compound, combined with a gas pressure regulator to control pressure and prevent voids, while using a conductor plate for heat transfer and strain/temperature sensors for real-time monitoring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hot press process equipment is used for compression molding, then molding quality is improved and material waste is reduced, but production cost increases and production rate decreases
Solution Approach 1:
The patent divides the heating function into multiple independent planar heating elements positioned at different locations (upper, lower, and side heating elements) that can operate independently. This segmentation allows parallel heating of multiple packages simultaneously, increasing production rate while maintaining molding quality through distributed heat application.
Solution Approach 2:
The patent replaces the complex mechanical hot press process equipment with a simpler system using planar heating elements combined with gas pressure regulation. This substitution eliminates the need for expensive hot press machinery while achieving comparable molding quality through thermal and pneumatic control instead of mechanical compression.
2Reliability
If hot press process equipment is used for compression molding, then molding quality is improved, but equipment cost and maintenance cost increase
Solution Approach 1:
The patent uses relatively simple and inexpensive planar heating elements and gas pressure regulators instead of expensive hot press process equipment. These components are easier to manufacture, replace, and maintain, reducing both initial equipment cost and ongoing maintenance costs while still achieving high molding quality.
Solution Approach 2:
The patent substitutes complex mechanical hot press equipment with a combination of thermal fields (planar heating elements) and pneumatic fields (gas pressure regulators). This replacement dramatically reduces equipment complexity, manufacturing cost, and maintenance requirements while maintaining or improving molding quality through better pressure and temperature control.
3Area of stationary object
If large area packages are molded using conventional equipment, then package size is increased, but power consumption increases significantly
Solution Approach 1:
The patent divides the heating task into multiple localized planar heating elements that can be independently controlled. Each heating element only needs to provide sufficient power for its local area, rather than one large heater covering the entire package area. This segmentation reduces total power consumption while enabling larger package areas to be molded.
Solution Approach 2:
The patent applies heating and pressure locally at each package position using planar heating elements and gas pressure regulators, rather than heating the entire equipment chamber. This localized approach means power is only consumed where needed, allowing large area packages to be molded without proportionally increasing total power consumption.
4Adaptability or versatility
If transfer molding is used, then complex package structures can be molded, but material waste and energy waste increase
Solution Approach 1:
The patent replaces the material-flow-based transfer molding process with a compression-based approach using gas pressure regulators and planar heating elements. This substitution eliminates the need for material to flow through complex pathways, reducing material waste while maintaining the ability to mold complex multi-layer package structures through direct compression and localized pressure control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces costs, time, and energy consumption by efficiently molding electronic packages with improved thermal conductivity and elastic modulus, maintaining quality and reducing material waste, while allowing for more flexible production and lower operational expenses.
Implementation Method 1
a planar heating element configured to mold an electronic package by approaching one surface of an electronic package to melt an epoxy molding compound disposed on the one surface of the electronic package
Implementation Method 2
melt an epoxy molding compound disposed on the one surface of the electronic package
Implementation Method 3
a gas pressure regulator configured to adjust gas pressure between the electronic package and the planar heating element
Data Source
AI summary
An electronic package molding device includes a planar heating element configured to mold an electronic package by approaching one surface of an electronic package to melt a molding agent disposed on the one surface of the electronic package and apply pressure to bring the epoxy molding compound into close contact with the electronic package and a gas pressure regulator configured to adjust gas pressure between the electronic package and the planar heating element.