Electronic Package Mounting With Intermediate Solder Void Venting
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Solution Overview
Problem
Conventional electronic packages face challenges in mounting to circuit boards due to void formation at the interface between solder balls and solder portions, which can lead to defects and increased manufacturing complexity and cost.
Innovation Solution
The electronic package design features a substrate with through-mold connections made of an alloy with a solidus temperature exceeding the liquidus temperature of the intermediate solder portions, eliminating the need for a moat or channel around the solder balls and allowing for a simpler mounting process that reduces void formation and manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional solder balls are used with moat or channel structures, then outgas venting is improved, but device complexity and manufacturing steps increase
Solution Approach 1:
The patent removes the moat or channel structure from the mold structure, extracting the outgas venting function from the mold and relocating it to the intermediate solder portion itself, which naturally provides outgas venting during reflow soldering without requiring additional structural features
Solution Approach 2:
The intermediate solder portion serves as an intermediary element that performs multiple functions: it couples the through-mold connection to the circuit board, provides outgas venting during reflow, and eliminates the need for both solder balls and moat structures while improving reliability
2Reliability
If conventional reflow soldering is used with solder balls, then mounting is achieved, but void formation increases and reliability decreases
Solution Approach 1:
The patent converts the potential harm of void formation into a benefit by designing the intermediate solder portion with intentional outgas venting capability, allowing gases to escape through the intermediate solder portion during reflow rather than forming voids at the interface, thereby improving reliability
Solution Approach 2:
The patent changes the material parameters by using an intermediate solder portion with a melting point lower than the through-mold connection material, enabling controlled melting and outgas venting during reflow soldering to prevent void formation
3Ease of operation
If through-mold connections with lower melting point are used, then ease of mounting is improved, but structural integrity during reflow deteriorates
Solution Approach 1:
The patent applies parameter changes by selecting materials with specific melting point relationships: the intermediate solder portion has a lower melting point than the through-mold connection material, allowing the intermediate solder to melt and provide outgas venting while the through-mold connection remains structurally intact during reflow soldering
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability of the mounting process by preventing voids and reducing manufacturing time and cost, while maintaining the structural integrity of the electronic package.
Implementation Method 1
the through-mold connection configured to have a melting point in excess of a melting point of the intermediate solder portion
Implementation Method 2
The fusing is achieved by a reflow soldering operation in which the package is subject to controlled heat at temperatures sufficient to liquify the solder portions
Data Source
AI summary
Methods are disclosed for mounting an electronic package to a circuit board are disclosed. The electronic package can be mounted to the circuit board by use of intermediate solder portions such that each intermediate solder portion couples a corresponding through-mold connection of the electronic package to the circuit board. The through-mold connections can have a melting point in excess of a melting point of the intermediate solder portions. Related electronic packages, electronic assemblies, electronic devices, and methods of manufacturing electronic packages are disclosed.