Package-on-Package Structure with Embedded Die and Protected Conductive Posts
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in efficiently stacking and connecting multiple semiconductor dies to enhance performance and efficiency, particularly in achieving reliable electrical connections and protection of conductive posts within a compact package structure.
Innovation Solution
The method involves forming a stacked die unit by bonding a second semiconductor die onto a first semiconductor die using fusion bonding or a die attach film, embedding it within a protective layer, and then encapsulating with an insulating material, followed by forming a redistribution layer to connect the conductive posts and ensure electrical connectivity between dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If multiple semiconductor dies are stacked to enhance performance, then communication paths between dies are shortened, but reliable electrical connections and protection of conductive posts become more difficult to achieve
Solution Approach 1:
The patent embeds conductive posts within protective layers and encapsulates them with insulating material, creating a nested structure where the conductive posts are protected by multiple concentric layers (protective layer, insulating encapsulant, redistribution layer) while maintaining their electrical connectivity function
Solution Approach 2:
The patent introduces intermediate protective layers and insulating encapsulants between the conductive posts and the external environment, acting as mediators that protect the conductive posts while allowing electrical connections to be established through the redistribution layer
2Speed
If multiple semiconductor dies are stacked to enhance performance, then communication paths between dies are shortened, but protection of conductive posts becomes more difficult
Solution Approach 1:
The conductive posts are nested within multiple protective layers including the protective layer and insulating encapsulant, creating a nested structure that shields the conductive posts from environmental harmful factors while maintaining their electrical function
Solution Approach 2:
The patent applies protective layers and insulating encapsulants beforehand to cushion and protect the conductive posts from potential harmful factors before they can cause damage, ensuring the reliability of the stacked die structure
3Reliability
If semiconductor dies are bonded using fusion bonding or die attach film, then electrical connections between dies are established, but device complexity increases
Solution Approach 1:
The patent combines the bonding process with subsequent protective layer formation and encapsulation steps, merging multiple operations into an integrated process flow that reduces overall device complexity while maintaining reliable electrical connections
4Object-affected harmful factors
If protective layers and insulating encapsulants are added to protect conductive posts, then protection is enhanced, but manufacturing complexity increases
Solution Approach 1:
The patent merges the formation of protective layers, insulating encapsulants, and redistribution layers into an integrated manufacturing process, where multiple protective functions are combined in a single streamlined process flow, making manufacturing easier while maintaining protection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for improved performance and efficiency by shortening communication paths between semiconductor dies, enhancing protection, and enabling more compact and reliable package structures, such as package-on-package configurations.
Implementation Method 1
bonding a second semiconductor die onto a first semiconductor die using fusion bonding or a die attach film
Data Source
AI summary
A package structure includes a first semiconductor die, a second semiconductor die, an insulating encapsulant and a redistribution layer. The first semiconductor die has first conductive posts and a first protection layer laterally surrounding the first conductive posts. The second semiconductor die is embedded in the first protection layer and surrounded by the first conductive posts of the first semiconductor die, wherein the second semiconductor die includes second conductive posts. The insulating encapsulant is encapsulating the first semiconductor die and the second semiconductor die. The redistribution layer is disposed on the insulating encapsulant and connected with the first conductive posts and the second conductive posts, wherein the first semiconductor die is electrically connected with the second semiconductor die through the first conductive posts, the redistribution layer and the second conductive posts.