Package-on-Package Interposer Slot Design for IC Size Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor packaging technologies face challenges in reducing the size of integrated circuit packages while maintaining performance, reliability, and manufacturing efficiency, as well as addressing the need for simplified manufacturing processes and reduced component count on circuit boards.
Innovation Solution
The method involves providing a substrate with a die and an interposer having slots, covering with a first encapsulant, and forming a hole to expose the peripheral portion of the interposer, allowing for increased reliability and reduced size through the use of a package-on-package configuration with a supporter that makes metal-to-metal connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If parts in the package are made thinner to reduce package size, then the size of the whole package is reduced, but manufacturing complexity and reliability issues increase
Solution Approach 1:
The package is divided into multiple functional layers: a substrate, a die mounted on the substrate, an interposer with slots mounted on the die, and a first encapsulant covering the die and interposer. This segmentation allows each layer to be optimized independently, enabling size reduction while maintaining manufacturing feasibility through modular construction
Solution Approach 2:
The patent implements a package-on-package configuration where the interposer is mounted over the die, and the first encapsulant covers both the die and interposer. This nested structure allows multiple functional components to be integrated in a vertical stack, reducing the overall footprint and package size while maintaining complex functionality
2Volume of moving object
If parts in the package are made thinner to reduce package size, then the size of the whole package is reduced, but reliability and performance are compromised
Solution Approach 1:
The patent employs composite material structures including an interposer with slots that provides mechanical support and electrical interconnection, combined with an encapsulant that provides protection and structural integrity. This composite approach allows thin profiling while maintaining strength and reliability through the synergistic combination of different materials and structures
Solution Approach 2:
The patent transitions from planar packaging to three-dimensional package-on-package architecture, where the interposer extends vertically above the die and the encapsulant provides overhead protection. This dimensional change allows size reduction in the horizontal plane while maintaining reliability through enhanced vertical support structures
3Ease of manufacture
If traditional packaging methods are used, then manufacturing is simpler, but the number of parts on circuit boards increases and functionality is limited
Solution Approach 1:
The interposer serves multiple functions simultaneously: it provides mechanical support for the die, establishes electrical interconnections through its slots, enables package-on-package stacking, and facilitates heat dissipation. This multi-functionality reduces the need for separate components on the circuit board, increasing system versatility while maintaining manufacturing efficiency
Data Source
AI summary
A method of manufacture of an integrated packaging system includes: providing a substrate; mounting a die over the substrate; mounting an interposer having a slot over the die; covering a first encapsulant over the die and the interposer, a central region of the interposer exposed from the first encapsulant; and forming a hole through the first encapsulant to expose a peripheral portion of the interposer.