Package-on-Package Module Integrating Passive Components and Connectors
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Solution Overview
Problem
As mobile displays become larger, there is a growing need for increased battery capacity, which in turn requires a reduction in the size of printed circuit boards (PCBs) and the need for modularization of electronic components to optimize mounting space, particularly for semiconductor packages and passive components.
Innovation Solution
An electronic component module is designed with a semiconductor package and a component package, both having redistribution layers and wiring structures, with a connector that allows for mechanical and electrical coupling to external devices, reducing the mounting space on the main board by integrating passive components and semiconductor chips in a compact configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If battery capacity is increased to meet growing mobile display needs, then energy storage capability is improved, but the area occupied by the battery increases
Solution Approach 1:
The patent combines the connector and passive components into a single integrated component package. The connector is disposed on the same substrate as the passive components, forming a unified module that reduces the total area required compared to having separate connector and passive component areas on the PCB.
Solution Approach 2:
The patent transitions from a two-dimensional PCB layout to a three-dimensional package structure. By stacking the semiconductor package, component package, and connector in vertical layers, the design moves functions from the planar PCB domain to the vertical Z-axis, effectively reducing the footprint area while maintaining all necessary functions.
2Ease of manufacture
If separate connectors and passive components are mounted on the main board, then ease of assembly is improved, but the mounting space on the main board increases
Solution Approach 1:
The patent merges the connector and passive components into a single integrated component package mounted on the PCB. This consolidation reduces the total mounting space required while maintaining manufacturing simplicity through standardized package assembly processes.
Solution Approach 2:
The patent implements a nested package structure where the semiconductor chip is encapsulated within the semiconductor package, which is then mounted on the PCB alongside the component package containing passive components. This nested arrangement optimizes space utilization by hierarchical integration.
3Ease of operation
If electrical connection paths are lengthened for separate component mounting, then ease of routing is improved, but noise increases
Solution Approach 1:
The patent combines the connector and passive components into a single integrated package, which significantly shortens the electrical connection paths between these components. The reduced trace lengths on the PCB minimize signal interference and noise while the internal package interconnections provide low-noise pathways.
Data Source
AI summary
An electronic component module includes a semiconductor package having a first surface provided as a mounting surface and a second surface opposing the first surface, and including a semiconductor chip, a component package having a first surface facing the second surface of the semiconductor package, and a second surface opposing the first surface of the component package, the component package including a passive component, and a connector disposed on the second surface of the component package and having a connection surface configured to be mechanically coupled to an external device, the connector including a plurality of connection lines arranged on the connection surface.