Package on Package Integrated Device Redistribution Layer
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Solution Overview
Problem
Conventional package on package (PoP) integrated devices have a form factor that is too large and thick, making them unsuitable for mobile computing devices, and they do not provide optimal performance in terms of signal, channel, and electrical speed.
Innovation Solution
The integration of a redistribution layer in the package on package configuration, which includes a first package with a redistribution portion and a second package stacked on top, utilizing interconnects such as solder balls and bumps, and through substrate vias (TSVs) to enhance electrical coupling and reduce physical size, allowing for better form factor and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional package on package (PoP) configuration is used, then multiple dies can be integrated vertically, but the form factor becomes too large and thick for mobile computing devices
Solution Approach 1:
The patent transitions from a conventional vertical stacking approach to a hybrid configuration where the first die is mounted on the first substrate and the second die is mounted on the second substrate, with the second substrate positioned at an angle (e.g., 45 degrees) relative to the first substrate. This angular arrangement reduces the overall height and footprint of the integrated device while maintaining vertical integration benefits.
Solution Approach 2:
The patent implements a nested structure where the second substrate is positioned within the spatial envelope defined by the first substrate assembly. The second die and its substrate are effectively nested within the overall device footprint, reducing the external dimensions while maintaining multiple die integration.
2Adaptability or versatility
If a conventional PoP configuration is used, then multiple dies are integrated, but the device thickness becomes excessive
Solution Approach 1:
By positioning the second substrate at an angle relative to the first substrate rather than directly above it, the patent redistributes the vertical space occupation. This angular configuration projects part of the second substrate's footprint laterally, reducing the overall height (thickness) of the integrated device while maintaining the multi-die integration.
Solution Approach 2:
The patent introduces flexibility in the spatial arrangement by allowing the second substrate to be positioned at various angles (e.g., 45 degrees) rather than fixed vertically. This dynamic positioning capability enables optimization of device thickness based on specific application requirements while maintaining integration functionality.
3Reliability
If a conventional PoP configuration is used, then dies are electrically connected, but signal performance and electrical speed are suboptimal
Solution Approach 1:
The patent introduces a redistribution layer as an intermediary structure between the first die and the second die. This redistribution layer optimizes the electrical signal paths by providing dedicated signal routing that reduces interference and improves signal integrity, thereby enhancing electrical speed performance while maintaining reliable connections.
Solution Approach 2:
The patent implements different interconnect structures for different signal types and functional requirements. The first interconnect structure connects the first die to the first substrate, while the second interconnect structure (including the redistribution layer) connects the second die to the first substrate. This localized optimization of interconnect quality improves overall signal performance.
Data Source
AI summary
Some features pertain to an integrated device that includes a first package, a set of interconnects, and a second package. The first package includes a first substrate comprising a first surface and a second surface. The first package includes a redistribution portion comprising a redistribution layer. The first package includes a first die coupled to the first surface of the first substrate. The set of interconnects is coupled to the redistribution portion of the first package. The second package is coupled to the first package through the set of interconnects. The second package includes a second substrate comprising a first surface and a second surface; and a second die coupled to the first surface of the second substrate, where the second die is electrically coupled to the first die through the second substrate of the second package, the set of interconnects, and the redistribution portion of the first package.