Package-on-Package Stacking Joint via Conductive Paste Flow
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Solution Overview
Problem
Current integrated circuit packaging systems face challenges in miniaturization, increased packaging density, performance, and cost reduction, particularly in portable devices, where existing solutions do not adequately address the need for improved chip interconnection and space savings while maintaining reliability and reducing manufacturing costs.
Innovation Solution
The method involves applying a conductive material on a support structure, attaching a bottom integrated circuit package with an extended lead, stacking a top package with an extended lead, and forming a stacking joint using conductive paste and material, which flows below and above the leads to secure a robust connection between the packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If integrated circuits are stacked into a single package to increase density, then packaging density is improved, but manufacturing reliability deteriorates due to inadequate interconnection
Solution Approach 1:
The patent transitions from planar packaging to three-dimensional stacking by extending leads vertically through multiple package layers. The bottom lead extends upward through the bottom package, and the top lead extends downward through the top package, enabling vertical interconnection that resolves the contradiction between increased density and maintained reliability.
Solution Approach 2:
The patent implements package-on-package structure where the top integrated circuit package is stacked over the bottom package. The extended leads penetrate through the package bodies, allowing nested configuration with robust mechanical and electrical connections that maintain reliability while increasing packaging density.
2Length of moving object
If miniaturization is pursued to reduce device size, then device dimensions are improved, but manufacturing precision deteriorates
Solution Approach 1:
The patent divides the packaging system into modular segments: bottom package, top package, bottom lead, and top lead. This segmentation allows each component to be manufactured and assembled separately with standard precision requirements, then combined through the stacking process, thereby maintaining manufacturing precision while achieving overall miniaturization.
3Adaptability or versatility
If more integrated circuits are integrated into each package to improve functionality, then functional integration is improved, but device complexity increases
Solution Approach 1:
The extended lead structure serves multiple functions simultaneously: it provides mechanical support, establishes electrical connections, enables vertical stacking, and facilitates robust interconnection between packages. This multi-functionality allows increased functional integration without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability and yield of the integrated circuit packaging system by forming a robust mechanical and electrical joint, reducing manufacturing defects, and achieving a high productivity yield of approximately 98%, thereby addressing the challenges of miniaturization, cost reduction, and performance improvement.
Implementation Method 1
forming a stacking joint by flowing the conductive paste and the conductive material
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: applying a conductive material on a support structure; providing a bottom integrated circuit package having a bottom lead extended therefrom; attaching the bottom lead to the conductive material; stacking a top integrated circuit package over the bottom integrated circuit package, the top integrated circuit package having a top lead extending therefrom and the top lead over the bottom lead; attaching a conductive paste at an end portion of the top lead; and forming a stacking joint by flowing the conductive paste and the conductive material, the stacking joint below the top lead as well as below and above the bottom lead.