Semiconductor Package Pad Structure for Stable Contact Resistance
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Solution Overview
Problem
The high susceptibility of I/O conductive pads in semiconductor packaging modules to oxidation and contamination leads to unstable contact resistance, affecting the electrical reliability of the packaging devices.
Innovation Solution
A packaging device design that includes a conductive layer with lower oxidative capacity than the I/O pads, surrounded by a buffer and insulation layer, to reduce the influence of organic materials and stabilize contact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal pads (aluminum or copper) are used for I/O conductive pads, then electrical conductivity is achieved, but the pads are highly susceptible to oxidation and contamination, causing unstable contact resistance
Solution Approach 1:
The patent introduces a conductive layer as an intermediary between the metal pad and the buffer layer. This conductive layer has lower oxidative capacity than the metal pad, serving as a protective mediator that reduces direct exposure of the highly reactive metal pad to oxidizing environments while maintaining electrical conductivity.
Solution Approach 2:
The patent creates a protective environment for the metal pad by positioning the conductive layer with lower oxidative capacity between the pad and external materials. This effectively creates an inert-like protective barrier that prevents oxidation and contamination of the metal pad without requiring vacuum or inert gas atmospheres.
2Reliability
If the pad material is used directly without additional layers, then manufacturing simplicity is maintained, but contact resistance becomes unstable due to environmental exposure
Solution Approach 1:
The conductive layer serves as a thin intermediary between the pad and buffer layer, adding minimal structural complexity while providing substantial protection against oxidation. This mediator layer stabilizes contact resistance without significantly increasing device complexity.
Solution Approach 2:
The patent changes the oxidative capacity parameter of the conductive layer relative to the pad material. By selecting materials with lower oxidative capacity for the conductive layer, the patent optimizes protection against oxidation while maintaining electrical conductivity, thus stabilizing contact resistance with minimal added complexity.
Data Source
AI summary
A packaging device and a manufacturing method thereof are provided. The packaging device includes an electronic unit, a conductive layer, a buffer layer, an insulation layer, and a first circuit structure. The electronic unit includes a pad. The conductive layer is disposed on the pad. The buffer layer is disposed on the conductive layer. The insulation layer surrounds the electronic unit and the buffer layer. The first circuit structure is electrically connected to the electronic unit. A part of the conductive layer is located between the electronic unit and the buffer layer, and an activity of the conductive layer is less than an activity of the pad.