Package Panel Singulation for Semiconductor Cost Reduction
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Solution Overview
Problem
The high capital investment required for large-scale equipment in wafer or panel level packaging processes poses a challenge for minimizing equipment and overall manufacturing costs, as these processes typically necessitate expensive machinery for semiconductor die packaging and interconnections.
Innovation Solution
A manufacturing method that involves cutting a package panel into singulated package strips before the package process, allowing for the use of existing equipment with modifications, and utilizing a substrate with tooling holes for stable attachment and processing, thereby reducing the need for large-scale equipment and optimizing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wafer level or panel level packaging processes are used, then packaging and interconnections can be completed before singulation, but large-scale equipment with high capital investment is required
Solution Approach 1:
The invention divides the packaging process into two stages: first, performing packaging operations on a package panel containing multiple integrated circuit components; second, singulating the panel into individual packages after packaging is complete. This segmentation allows using smaller, less expensive equipment for each stage rather than requiring one large-scale system to handle both packaging and singulation simultaneously.
Solution Approach 2:
The invention performs preliminary packaging operations on the entire package panel before singulation occurs. By completing die bonding, wire bonding, and encapsulation on the panel-level first, then separating into individual packages, the process eliminates the need for expensive wafer-level equipment while maintaining packaging quality and integration.
2Productivity
If large-scale equipment is used for wafer or panel level packaging, then processing can be completed before singulation, but capital investment costs increase significantly
Solution Approach 1:
The invention segments the manufacturing process into panel-level packaging followed by singulation, allowing the use of smaller, more affordable equipment for each discrete operation. This eliminates the need for expensive large-scale wafer-level packaging equipment while maintaining the ability to process multiple components efficiently through batch panel processing.
Solution Approach 2:
The invention uses a reusable substrate or carrier that can be reused across multiple packaging cycles. The substrate with attachment regions and tooling holes serves as a template that guides the packaging process and can be reused, reducing the need for expensive disposable fixtures and reducing overall equipment investment requirements.
3Device complexity
If existing equipment is used with modifications, then equipment costs are minimized, but processing stability must be maintained
Solution Approach 1:
The substrate design incorporates universal features including tooling holes that can be used for both attachment and positioning functions, and attachment regions that can accommodate different package configurations. This multi-functionality allows existing equipment to be used for multiple operations without requiring specialized fixtures for each process step, maintaining stability while using simpler equipment.
Solution Approach 2:
The invention changes the processing parameters from wafer-level dimensions to panel-level dimensions, and from continuous wafer processing to discrete panel processing followed by singulation. These parameter changes allow the use of existing equipment with modified tooling while maintaining process stability through controlled variable adjustments rather than requiring entirely new equipment systems.
Data Source
AI summary
A manufacturing method of a package structure is provided. The method includes the following steps. A package panel is provided. The package panel includes a first encapsulation, a plurality of first integrated circuit components and a plurality of redistribution circuit patterns electrically connected to the first integrated circuit components, the first integrated circuit components are encapsulated by the first encapsulation, and the redistribution circuit patterns are distributed on the first encapsulation and the first integrated circuit components. The first encapsulation of the package panel is cut to form a plurality of singulated package strips. One of the singulated package strips is attached onto an attachment region of a substrate. The substrate includes at least one tooling hole distributed outside of the attachment region. The package process is performed over the singulated package strip with the substrate affixed through the tooling hole to form the package structure.