Electronic Package Moisture Resistance via Multi-Layer Passivation

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Solution Overview

Problem

The existing electronic device package structures are vulnerable to moisture ingress, which can degrade the T-contact and reduce the performance and reliability of electronic devices.

Innovation Solution

The proposed electronic device package structure includes a substrate, an electronic chip, a bonding pad, a first passivation layer, a conductive layer, and a second passivation layer, where the second passivation layer covers the second side end of the conductive layer, preventing moisture entry and enhancing reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the second passivation layer only covers the conductive layer, then the manufacturing process is simple, but moisture enters along the exposed second side end causing degradation

Engineering Contradiction:

Improvemoisture resistanceVSAvoidpassivation layer structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The second passivation layer is extended from a single-plane coverage to a multi-dimensional structure that covers the top surface, sidewall, and second side end of the conductive layer, creating a complete three-dimensional protective barrier against moisture ingress

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The passivation protection is divided into two distinct layers: the first passivation layer providing base protection and the second passivation layer providing enhanced coverage of the conductive layer including its exposed ends, with each layer performing specific protective functions

Inventive Principle:

Principle #1Segmentation

2Reliability

If the second passivation layer completely covers the second side end with the first passivation layer, then moisture entry is prevented, but the manufacturing precision requirement increases

Engineering Contradiction:

ImproveT-contact protectionVSAvoidpassivation layer alignment

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The first passivation layer is formed and extended to cover the second side end of the conductive layer in advance, creating a pre-positioned protective barrier that simplifies subsequent processing and ensures moisture protection before final assembly

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The first and second passivation layers are merged to provide comprehensive coverage of the conductive layer, with their combined structure ensuring complete protection of the second side end while distributing the manufacturing precision requirements across multiple formation steps

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS8975739B2Package structure and method for manufacturing thereof

Publication Date: 2015.03.10 XINTEC INC

AI summary

The invention provides an electronic device package and method for manufacturing thereof. The electronic device package includes a substrate, an electronic chip, a bonding pad, a first passivation layer, a conductive layer, a second passivation layer, and a solder ball. The conductive layer has a first side end and a second side end, and the solder ball is positioned on the first side end of the conductive layer. The second passivation layer contacts with both the upper surface and the sidewall of the second side end of the conductive layer, and the first passivation layer contacts with the lower surface of the second side end of the conductive layer, so as to completely encapsulate the second end of the conductive layer. The electronic device package accordingly prevents the moisture penetration and to enhance the reliability of the electronic device.