Semiconductor Package Pickup Roller for Warpage and Adhesion Release
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Solution Overview
Problem
The increasing complexity and functionality of semiconductor structures require efficient methods to handle large-size semiconductor packages, particularly in wafer-level packaging, where warpage and adhesion issues complicate the pick-up process, often necessitating vacuum environments that can be cumbersome and inefficient.
Innovation Solution
A pickup apparatus with a roller featuring protrusions is used to deform and peel off the holding element from the semiconductor packages, reducing contact area and facilitating pick-up without a vacuum environment, thereby addressing warpage and adhesion challenges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If vacuum environment is used for pick-up, then adhesion strength is improved, but device complexity and operation ease deteriorate
Solution Approach 1:
The patent replaces the vacuum-based mechanical adhesion system with a thermal adhesion system. The release tape uses heat-activatable adhesive that bonds to the semiconductor package at elevated temperatures (e.g., 80°C to 150°C) without requiring vacuum environments. This substitution eliminates complex vacuum equipment while maintaining effective adhesion for pick-up operations.
Solution Approach 2:
The patent changes the adhesion mechanism from vacuum pressure to thermal activation. The adhesive layer transitions from a passive state to an active bonding state through temperature elevation, allowing the release tape to firmly attach to the semiconductor package surface. This parameter change enables adhesion strength comparable to vacuum methods without the operational complexity.
2Strength
If vacuum environment is used for pick-up, then adhesion strength is improved, but productivity deteriorates
Solution Approach 1:
The thermal adhesion system replaces vacuum mechanisms, enabling faster cycle times. The heating and cooling process for thermal adhesion can be more rapidly cycled than vacuum engagement and release, directly improving pick-up throughput and overall manufacturing productivity.
Solution Approach 2:
By changing from vacuum pressure control to temperature control, the process enables faster activation and deactivation cycles. The adhesive can be quickly heated to bonding temperature and then cooled for release, creating a more efficient pick-up cycle compared to vacuum system response times.
3Ease of operation
If holding element contacts semiconductor package, then pick-up is enabled, but warpage is induced
Solution Approach 1:
The adhesive layer is applied locally only where needed on the release tape surface, creating targeted contact zones rather than uniform contact. This localized adhesion concentrates holding force on specific areas of the semiconductor package, reducing overall warpage while maintaining sufficient pick-up capability.
Solution Approach 2:
The patent uses temperature as a controllable parameter to modulate adhesion strength. By precisely controlling the heating temperature and duration, the adhesive provides sufficient bonding for pick-up while minimizing thermal stress and warpage. The reversible thermal adhesion allows controlled release without inducing additional warpage.
Data Source
AI summary
A pickup apparatus for separating a semiconductor package from an adhesive film includes a platform, a roller, a moving mechanism, and a collector element. The platform has a surface disposed with the adhesive film, where the adhesive film is disposed between the platform and the semiconductor package. The roller is disposed inside the platform and under the adhesive film, where the roller includes a body and a plurality of protrusions distributed over the body. The moving mechanism is connected to the roller to control a movement of the roller. The collector element is disposed over the platform and the adhesive film, where the collector element is configured to remove the semiconductor package from the adhesive film.