Semiconductor Package Pier Adhesive for Controlled Side-Fill
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Solution Overview
Problem
Conventional semiconductor packaging processes face challenges in accurately controlling adhesive penetration during side-fill dispensing, leading to defects such as solder ball deformation, open circuits, and short circuits due to excessive adhesive penetration and thermal expansion issues, which increase manufacturing costs and affect product reliability.
Innovation Solution
A package structure and method involving a two-stage or multi-stage dispensing process to form a pier adhesive, where a first adhesive is applied on the substrate and a second adhesive is applied between the side surface and the first adhesive, allowing precise control of fillet height and width to prevent excessive penetration and strengthen the semiconductor package sides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If side-fill dispensing is used to replace underfill dispensing, then the complexity of cleaning and treatment processes is reduced, but excessive underneath adhesive penetration occurs causing solder joint defects
Solution Approach 1:
The adhesive dispensing process is divided into two distinct stages: first dispensing adhesive at a first location away from the component, then dispensing adhesive at a second location adjacent to the component. This segmentation allows precise control over adhesive penetration, preventing excessive underneath penetration while maintaining process simplicity.
Solution Approach 2:
The patent introduces an intermediary approach by using two separate dispensing locations and amounts rather than a single direct dispensing action. The first adhesive application acts as an intermediary step that prepares the path for the second application, enabling controlled penetration without direct excessive contact.
2Reliability
If adhesive is completely filled during dispensing, then reliability of solder joints is improved, but additional cleaning and treatment processes are required increasing manufacturing cost
Solution Approach 1:
Instead of completely filling the adhesive in a single excessive action that requires cleaning, the patent uses two controlled dispensing actions. The first dispensing provides partial filling at a distance, and the second completes the filling adjacent to the component, achieving complete fill without the need for additional cleaning processes.
3Manufacturing precision
If adhesive penetrates underneath the component, then filling completeness is improved, but solder balls and solder joints are affected by thermal expansions causing defects
Solution Approach 1:
The patent applies different adhesive dispensing strategies at different locations: at the first location away from the component, adhesive is dispensed in a controlled amount that prevents excessive penetration; at the second location adjacent to the component, adhesive is dispensed to ensure complete filling. This local quality approach ensures filling completeness while protecting solder joints from excessive penetration effects.
Data Source
AI summary
A package structure and a method for fabricating the same are provided. The package structure includes a substrate, a semiconductor package, a first adhesive and a second adhesive. The substrate has a first board surface and a second board surface, and a second region surrounds a first region on the first board surface. The semiconductor package has an upper surface, a lower surface, and a side surface, and is disposed on the first board surface. The first adhesive is formed on the first board surface, in the second region and in a portion of the first region adjacent to the second region. The second adhesive is formed between the side surface and the first adhesive and contacts the side surface and the first adhesive, and the first adhesive and the second adhesive together form a pier adhesive.