Electronic Component Package Pins With Side-Surface Soldering
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic component packaging technologies, such as land grid array (LGA), suffer from poor soldering reliability due to surface-mount packaging, leading to potential failures under long-term vibration or temperature changes, which affects the reliability of electronic devices.
Innovation Solution
The electronic component package body features pins with soldering areas of different dimensions, embedded within the substrate and exposed on both the bottom and side surfaces, allowing for enhanced soldering strength and heat dissipation through metal pins with high thermal conductivity, and a protective layer to prevent oxidation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If surface-mount packaging (LGA) is used to fasten package body and circuit board, then assembly is simple and efficient, but soldering reliability is poor and soldering joints easily break under vibration or temperature changes
Solution Approach 1:
The patent transitions from traditional surface-mount LGA packaging to side surface exposure packaging. The pins are exposed on the side surface of the substrate rather than only on the bottom surface, adding a dimensional aspect to the soldering interface. This allows solder to wrap around the pins from multiple directions, creating a more robust three-dimensional solder joint that resists mechanical stress and thermal expansion better than conventional two-dimensional surface mounting.
2Ease of manufacture
If pins are exposed only on bottom surface (traditional LGA), then manufacturing process is simple, but soldering area is limited and soldering strength is insufficient
Solution Approach 1:
The patent merges the soldering functions of the bottom surface and side surface into a unified soldering interface. Both surfaces are exposed and participate in the soldering process simultaneously, creating a combined soldering area that leverages the advantages of both orientations. This merged interface provides enhanced mechanical interlocking and distributes stress more effectively across the joint.
3Ease of operation
If traditional LGA surface contact soldering is used, then assembly process is straightforward, but heat dissipation performance is insufficient affecting reliability under long-term vibration or temperature changes
Solution Approach 1:
The side surface exposure configuration extends the heat dissipation interface from a single-plane contact to a multi-dimensional thermal pathway. Heat can conduct through the pins and dissipate through both the bottom surface contact with the circuit board and the side surface exposure, creating redundant thermal pathways that improve overall heat dissipation efficiency and reduce thermal accumulation during operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the reliability of soldering between the electronic component package body and the circuit board by increasing soldering areas and heat dissipation performance, reducing the risk of solder joint failure due to vibration, and enhancing overall board-level reliability.
Implementation Method 1
metal pins with high thermal conductivity
Implementation Method 2
a protective layer to prevent oxidation
Data Source
Figure 1~2
Figure 3~4
Figure 5~6a
AI summary
Embodiments of this application disclose an electronic component package body, an electronic component package assembly, and an electronic device. The electronic component package body includes a substrate, an electronic component, and first pins. The substrate includes a bottom surface, a top surface, and a first side surface. The first side surface is connected between the bottom surface and the top surface. The electronic component is packaged inside the substrate. The first pins are embedded in the substrate, and penetrate from the bottom surface to the top surface. The first pin includes a bottom surface and a side surface connected to the bottom surface. The bottom surface is exposed relative to the bottom surface, and at least a partial structure of the side surface is exposed relative to the first side surface. Both the bottom surface and the side surface are used for soldering with solder. Reliability of soldering the electronic component package body provided in this application and a circuit board is high.