Electronic Component Package Pins for Stronger Board Solder Joints
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Solution Overview
Problem
The reliability of soldering between electronic component package bodies and circuit boards is poor due to the surface-mount packaging nature of land grid arrays, leading to potential solder joint failure under mechanical vibration or temperature changes.
Innovation Solution
The electronic component package body features pins with soldering areas of different dimensions, including both bottom and side surfaces, to increase the soldering area and strength, using materials like copper or gold that are not remelted during the soldering process, and incorporating grooves to enhance surface area exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If land grid array (LGA) surface-mount packaging is used to fasten the packaged component and circuit board, then the assembly process is simplified, but the soldering reliability deteriorates because soldering is done through surface contact which is easily broken under mechanical vibration or temperature changes
Solution Approach 1:
The pin structure transitions from a two-dimensional surface contact (LGA) to a three-dimensional configuration where the pin protrudes from the substrate. The solder joint wraps around the pin in multiple dimensions, creating a立体 (spatial) connection that engages both the bottom surface and side surface of the pin, thereby increasing soldering reliability while maintaining assembly simplicity
Solution Approach 2:
The pin is divided into multiple functional segments: an embedded portion within the substrate and a protruding portion extending outward. This segmentation allows the pin to serve dual purposes - electrical connection through the substrate and mechanical soldering attachment at the protruding end, resolving the contradiction between assembly ease and soldering reliability
2Ease of manufacture
If the pin has a simple cylindrical structure, then the manufacturing process is simple, but the soldering area is limited reducing soldering strength
Solution Approach 1:
The pin structure evolves from a simple cylinder to a three-dimensional form with an enlarged bottom surface and protruding sides. This dimensional enhancement provides multiple soldering surfaces (bottom and side surfaces) that increase the total soldering area and strength without significantly complicating the manufacturing process
Solution Approach 2:
The pin exhibits non-uniform geometry with different surface characteristics at different locations: the bottom surface is enlarged to provide a broad soldering base, while the side surfaces protrude to engage solder from lateral directions. This local variation in geometry optimizes soldering strength while maintaining manufacturing feasibility
Data Source
AI summary
Embodiments of this application disclose an electronic component package body, an electronic component assembly structure, and an electronic device. The electronic component assembly structure includes: an electronic component package body, where the electronic component package body includes a substrate, an electronic component, and a pin; the electronic component is packaged inside the substrate, and the pin is electrically connected to the electronic component; the pin includes a first part embedded in the substrate, and a second part protruding from the substrate; the second part includes a bottom surface and a side surface, the bottom surface is an outer surface that is of the pin and that is away from the substrate, and the side surface is connected between the bottom surface and the substrate. In this application, reliability of soldering between the electronic component package body and the circuit board is relatively high.