Semiconductor Package Pitch Translation for Multi-Board Compatibility
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Solution Overview
Problem
Semiconductor packages designed for high-density interconnect boards are not easily adaptable to low-density interconnect boards due to pitch mismatch, requiring significant redesign and resource allocation for compatibility.
Innovation Solution
The reuse of semiconductor package designs with smaller pitch interconnects is facilitated by integrating Redistribution Layers and routing structures to translate the pitch, allowing the same package to be compatible with both high-density and low-density interconnect boards, while unused space is utilized for mechanical rigidity and electrical routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If semiconductor packages are designed for high-density interconnect boards with small pitch, then manufacturing precision and interconnect density are improved, but adaptability to low-density interconnect boards deteriorates
Solution Approach 1:
A substrate is introduced as an intermediary component between the semiconductor die and the interconnect board. The substrate includes a first pitch interconnect layer matching the die and a second pitch interconnect layer matching the board, with routing structures that translate between the two pitches. This intermediary substrate resolves the pitch mismatch between high-density and low-density interconnect requirements.
Solution Approach 2:
The pitch translation is achieved by adding a dimensional layer (the substrate) between the die and board. Instead of changing the pitch on a single plane, the solution uses multiple layers with different pitch characteristics, translating the interconnect pitch through vertical stacking and routing across layers.
2Adaptability or versatility
If Redistribution Layers and routing structures are integrated to translate pitch, then adaptability to different board types is improved, but device complexity increases
Solution Approach 1:
The substrate is designed as a universal platform that can interface with both high-density and low-density interconnect boards. By integrating multiple pitch interconnect layers and routing structures, the single substrate design serves multiple board compatibility functions, allowing the same semiconductor package to be used across different board types without redesign.
3Stability of the object's composition
If unused space in the package is utilized for mechanical rigidity, then structural stability is improved, but manufacturing complexity increases
Solution Approach 1:
The substrate integrates multiple functions into a single structure: electrical interconnection, pitch translation, and mechanical support. By merging the mechanical reinforcement function with the existing substrate structure, the unused space is utilized to provide rigidity without adding separate components, thus improving manufacturing efficiency despite the increased structural complexity.
Data Source
AI summary
A semiconductor package is disclosed, which comprises a substrate, one or more dies on a first side of the substrate, and a plurality of interconnect structures having a first pitch and coupled to a second side of the substrate. The interconnect structures may attach the substrate to a board. The substrate may include a first interconnect layer having a second pitch. The first interconnect layer may be coupled to the one or more dies through second one or more interconnect layers. Third one or more interconnect layers between the first interconnect layer and the interconnect structures may translate the first pitch to the second pitch. The substrate may include a recess on a section of the second side of the substrate. The semiconductor package may further include one or more components within the recess and attached to the second side of the substrate.