Electronic Package Planarization via Temporary Substrate Mediator
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Solution Overview
Problem
The existing 'chips last' packaging process for electronic component packages faces challenges in achieving a smooth surface for the formation of redistribution structures due to the roughness of the sacrificial material, leading to potential defects and the need for thicker layers to compensate for non-planarity.
Innovation Solution
Applying a second temporary substrate to the sacrificial material before curing allows for a smoother surface, enabling easier removal and providing a planar surface for the formation of redistribution structures, which can be thinner and less prone to defects, and allows for curing in an oxygen-free environment with minimal damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If sacrificial material is used in the chips last packaging process, then the packaging structure can be formed, but the surface becomes rough and non-planar
Solution Approach 1:
A planarization layer is introduced as an intermediary between the rough sacrificial material and the redistribution structure. This layer provides a smooth, planar surface for subsequent processing while the sacrificial material maintains its structural function, thus resolving the contradiction between ease of manufacture and manufacturing precision.
Solution Approach 2:
The packaging structure is segmented into distinct functional layers: the sacrificial material layer for structural support, the planarization layer for surface smoothness, and the redistribution structure for electrical functions. This segmentation allows each layer to optimize its specific function without compromising others.
2Manufacturing precision
If thicker layers are used to compensate for non-planarity, then surface defects are reduced, but the overall package thickness increases
Solution Approach 1:
The planarization layer acts as a mediator that provides surface defect reduction through a controlled, thin layer rather than requiring thick compensatory layers. This achieves the necessary surface quality while minimizing the increase in overall package thickness.
Solution Approach 2:
The thickness of the planarization layer is precisely controlled and optimized to provide sufficient surface planarity without excessive thickness. By changing and optimizing the thickness parameter of this intermediate layer, the contradiction between defect reduction and thickness control is resolved.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method results in electronic component packages with reduced thickness and minimal defects, improved planarity, and enhanced reliability by providing a smooth surface for redistribution structure formation, enabling thinner layers and better protection during storage and transport.
Implementation Method 1
a sacrificial material is applied to a first temporary substrate, a second temporary substrate is applied to the sacrificial material, and the sacrificial material is cured
Data Source
AI summary
In making electronic component packages, a method includes forming a sacrificial material over a first temporary substrate, applying a second temporary substrate to the sacrificial material, and then curing the sacrificial material. After curing, the second temporary substrate is removed. The top surface of the sacrificial layer is defined by the second temporary substrate. After removal, a redistribution structure is formed on the top surface. After the formation of the redistribution structure, electronic components are applied to the redistribution structure. The electronic components are encapsulated to form an encapsulated panel. The first temporary substrate and the sacrificial material are removed. The panel is singulated into multiple electronic component packages.