Semiconductor Package Molding Powder Dispensing for Uniform Encapsulation
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Solution Overview
Problem
The challenge in compression molding of semiconductor packages is the uniform distribution of molding powder after dispensing, which affects the encapsulation process and can lead to non-uniformity and potential displacement of semiconductor devices.
Innovation Solution
A system and method involving precise measurement and controlled dispensing of molding powder onto a carrier with semiconductor devices, using a measurement unit and dispensing unit to ensure uniform distribution, followed by heating and compression to form a uniform encapsulant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If molding powder is dispensed on semiconductor devices, then encapsulation is achieved, but non-uniform distribution causes device displacement and height variation
Solution Approach 1:
The patent applies preliminary action by pre-heating the molding powder to a specific temperature range (80°C to 150°C) before dispensing. This pre-heating treatment modifies the physical properties of the powder, improving its flow characteristics and enabling more uniform distribution during the dispensing process, thereby preventing device displacement and reducing height variation in the final encapsulant.
Solution Approach 2:
The patent changes physical parameters of the molding powder, specifically temperature, to resolve the distribution uniformity issue. By controlling the powder temperature within a specific range before dispensing, the flowability and packing density are optimized, achieving uniform distribution that prevents device displacement while maintaining reliable encapsulation.
2Reliability
If compression molding is applied to encapulate semiconductor devices, then protection is achieved, but device displacement occurs due to non-uniform powder distribution
Solution Approach 1:
The patent applies preliminary action by pre-heating the molding powder to a specific temperature range (80°C to 150°C) before dispensing. This pre-heating treatment modifies the physical properties of the powder, improving its flow characteristics and enabling more uniform distribution during the dispensing process, thereby preventing device displacement and reducing height variation in the final encapsulant.
Solution Approach 2:
The patent changes physical parameters of the molding powder, specifically temperature, to resolve the distribution uniformity issue. By controlling the powder temperature within a specific range before dispensing, the flowability and packing density are optimized, achieving uniform distribution that prevents device displacement while maintaining reliable encapsulation.
3Ease of manufacture
If molding powder is heated and compressed, then encapsulant formation is achieved, but height variation and non-uniformity increase
Solution Approach 1:
The patent applies preliminary action by pre-heating the molding powder to a specific temperature range (80°C to 150°C) before dispensing. This pre-heating treatment modifies the physical properties of the powder, improving its flow characteristics and enabling more uniform distribution during the dispensing process, thereby preventing device displacement and reducing height variation in the final encapsulant.
Solution Approach 2:
The patent changes physical parameters of the molding powder, specifically temperature, to resolve the distribution uniformity issue. By controlling the powder temperature within a specific range before dispensing, the flowability and packing density are optimized, achieving uniform distribution that prevents device displacement while maintaining reliable encapsulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves a uniformly distributed molding compound with minimal height variation, preventing semiconductor device displacement during compression, resulting in a stable and consistent semiconductor package structure.
Implementation Method 1
measuring an amount of a molding powder
Implementation Method 2
After the plastic molding powder is melted by heating to become a fluid molding compound
Implementation Method 3
a mold chase is used to compress the fluid molding compound or the gel molding compound
Implementation Method 4
the molding compound is cured or solidified to form an encapsulant to cover the semiconductor die
Data Source
AI summary
A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) measuring an amount of a molding powder; (b) controlling the amount of a molding powder; and (c) dispensing the molding powder on an assembly structure including a carrier and at least one semiconductor device disposed on the carrier.