Package Pre-Match Circuit Harmonic Suppression
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Solution Overview
Problem
Integrated circuit packages face challenges in impedance matching between the package and printed circuit board (PCB), leading to issues with signal transmission and radiation of higher harmonics, with existing solutions like 'Known Good Die' being impractical and 'low-temperature co-fired ceramic' being costly.
Innovation Solution
The integration of a pre-match circuit within the package, designed to achieve impedance matching close to the chip outputs, using transmission lines configured to short unwanted harmonic frequencies and employing multiple open-circuited or short-circuited transmission lines to control harmonic behavior, while maintaining the benefits of packaged chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a pre-match circuit is integrated within the package, then impedance matching performance is improved, but device complexity increases
Solution Approach 1:
The pre-match circuit is merged with the package substrate, integrating the impedance matching function directly into the package structure. This eliminates the need for separate pre-match circuits on the PCB, improving impedance matching performance while the integration approach manages the complexity increase through consolidation rather than addition of discrete components.
Solution Approach 2:
The package substrate is designed to serve multiple functions: mechanical support, electrical connection, and impedance matching. By making the substrate multi-functional, the patent reduces the need for additional dedicated impedance matching components, thereby improving performance without proportionally increasing overall device complexity.
2Object-generated harmful factors
If transmission lines are used to short harmonic frequencies, then radiation of higher harmonics is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent uses parameter changes in the transmission line design, specifically adjusting the electrical length and characteristic impedance of the transmission lines to create artificial impedance discontinuities that present high impedance to harmonic frequencies. This allows the transmission lines to act as harmonic suppressors without requiring extremely tight manufacturing tolerances, as the effect is achieved through deliberate parameter selection rather than perfect geometric precision.
3Reliability
If multiple open-circuited or short-circuited transmission lines are employed, then harmonic control is improved, but device complexity increases
Solution Approach 1:
The harmonic control function is segmented into multiple transmission lines, each with specific open-circuited or short-circuited configurations. By dividing the harmonic suppression task across multiple specialized transmission lines rather than using a single complex circuit, the patent achieves improved harmonic control while managing complexity through functional segmentation and specialization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively addresses impedance matching and reduces external radiation of higher harmonics, enhancing the performance of integrated circuit packages by integrating the pre-match circuit within the package, thus improving signal transmission and reducing noise.
Implementation Method 1
The first pair of stubs is configured to form a short circuit for at least one harmonic frequency of the main frequency component in the signal
Implementation Method 2
The two transmission lines are connected to a pre-match circuit which transforms an impedance of the two transmission lines to an impedance of the die
Data Source
AI summary
A package is connected at a first side to a printed circuit board and with a die fixed to it on a second side opposite to the first side. The package has an integrated pre-match circuit to provide an impedance match for a signal to be sent to a circuit external to the package. The signal has a predetermined main frequency component. The pre-match circuit has a pair of transmission lines and a pair of stubs on a predetermined layer of the package and connected to the pair of transmission lines. The pair of stubs have a length such as to form a short circuit for an harmonic frequency of the main frequency component in the signal.