Electronic Package Assembly with Pre-Cut Reinforcement Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional manufacturing processes for semiconductor packages face issues such as adhesive layer softening and deformation during thermal compression, leading to structural damage and deviations, which adversely affect yield rates.
Innovation Solution
A manufacturing method involving pre-cutting with reinforcing structures on the adhesive layer, followed by thermal compression and singulation, to maintain structural integrity and alignment of packaging units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal compression process is performed to couple PIC components, then electrical connection is achieved, but adhesive layer softens and deforms causing structural damage
Solution Approach 1:
The patent segments the adhesive layer into two distinct layers: a first adhesive layer for bonding the packaging module to the carrier, and a second adhesive layer for coupling the PIC component to the packaging module. This segmentation allows each layer to be optimized for its specific function, with the second layer being specifically designed to withstand thermal compression without deforming the first layer.
Solution Approach 2:
The patent introduces a third-layer structure (comprising the second adhesive layer and the PIC component) as an intermediary between the first adhesive layer and the compression force. This intermediary structure distributes and absorbs the thermal compression forces, preventing direct transmission of damaging forces to the first adhesive layer while enabling successful electrical coupling.
2Force
If downward pressing force is applied during thermal compression, then PIC component is coupled firmly, but adhesive material deforms causing bulge and fan-out module fracture
Solution Approach 1:
The patent divides the adhesive bonding system into two separate layers, allowing the second adhesive layer to bear the compression force during PIC coupling while the first adhesive layer remains protected. This segmentation prevents force transmission that would cause bulging and fracture in the fan-out module.
Solution Approach 2:
The first adhesive layer is applied beforehand as a cushioning layer that provides structural support and protection. This pre-applied layer acts as a buffer that prevents direct transmission of compression forces to the fan-out module, thereby preventing bulge formation and fracture during the thermal compression process.
3Temperature
If adhesive layer is softened by heat, then thermal compression is effective, but fan-out module slides and deviates causing manufacturing defects
Solution Approach 1:
The patent segments the adhesive system into two layers with different thermal responses. The first adhesive layer maintains its bonding strength at thermal compression temperatures, while the second adhesive layer is designed to soften at these temperatures to enable effective PIC coupling. This segmentation allows temperature-induced softening in the second layer without compromising the alignment stability provided by the first layer.
Solution Approach 2:
The patent applies different adhesive materials with different thermal properties to different locations in the bonding system. The first adhesive layer has high thermal stability for maintaining alignment, while the second adhesive layer has lower melting point for enabling coupling. This local differentiation of material properties allows simultaneous achievement of alignment precision and coupling effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents deformation and maintains part alignment, enhancing manufacturing yield without additional materials or equipment costs.
Implementation Method 1
adhering a packaging module onto a surface of a carrier through a first adhesive layer
Implementation Method 2
performing a pre-cutting process to cut form the top end of the packaging module along each of the first cutting paths down to the surface of the first adhesive layer
Implementation Method 3
electrically connecting a plurality of optoelectronic components to the corresponding packaging units
Implementation Method 4
performing a singulation process to cut from a remaining portion of the top end of the packaging module along each of the second cutting paths down to the first adhesive layer
Data Source
AI summary
A manufacturing method of an electronic package is provided, which includes: adhering a packaging module to a surface of a carrier through a first adhesive layer, in which the packaging module has a plurality of packaging units jointly defined by first and second cutting paths; performing a pre-cutting process to cut along each of the first cutting paths; disposing at least one reinforcement structure on the surface of the first adhesive layer; adhering a plurality of optoelectronic components to the packaging units through a second adhesive layer; electrically connecting each of the optoelectronic components to a corresponding one of the packaging units; performing a singulation process to cut down the packaging module along the second cutting paths; and removing the reinforcing structure, the first adhesive layer and the carrier to form a plurality of the electronic packages.