Semiconductor Package Protection Structure for Delamination Prevention

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Solution Overview

Problem

The semiconductor industry faces challenges in manufacturing miniaturized semiconductor devices due to increased complexity, leading to issues like delamination and yield loss, particularly in integrated fan-out (InFO) packages, where the transition from inorganic to organic interfaces during encapsulation causes delamination and cracking.

Innovation Solution

A manufacturing method involving a pre-cutting process to form die stack structures over a support substrate, followed by the formation of protection structures that cover the die stacks, replacing the inorganic-organic interface with an organic-organic interface to prevent delamination, and encapsulating the package components with a molding compound while maintaining the protection structure's integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If miniaturized semiconductor devices are manufactured to achieve higher integration density, then the integration density is improved, but the manufacturing complexity increases leading to delamination and yield loss

Engineering Contradiction:

Improveintegration densityVSAvoidyield

Core Design Contradiction:

Area of moving objectVSReliability

Solution Approach 1:

The patent applies preliminary action by performing a pre-cutting process to form die stack structures with exposed sidewalls before encapsulation. This preliminary structuring allows subsequent protection structures to be formed that specifically address the delamination risk at the inorganic-organic interface, thereby improving yield while enabling miniaturized devices with high integration density

Inventive Principle:

Principle #10Preliminary action

2Volume of moving object

If inorganic-organic interface is used during encapsulation to achieve compact packaging, then the package compactness is improved, but delamination and cracking occur at the interface

Engineering Contradiction:

Improvepackage compactnessVSAvoidinterface adhesion

Core Design Contradiction:

Volume of moving objectVSStrength

Solution Approach 1:

The patent introduces protection structures as intermediary elements between the inorganic multi-layered structure and the organic encapsulant. These protection structures cover the exposed sidewalls and create a transition zone that prevents direct contact between incompatible inorganic and organic materials, thereby eliminating delamination while maintaining package compactness

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The protection structures function as temporary protective elements that are formed during manufacturing but are not part of the final product structure. These structures serve their protective purpose during encapsulation and can be removed or remain as non-critical features, enabling the process to overcome the inorganic-organic interface problem without adding permanent complexity

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Data Source

PatentUS20240105701A1Package structure and manufacturing method thereof

Publication Date: 2024.03.28 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A package structure and methods for forming the package structure are provided. The package structure includes a package component, an encapsulant disposed around the package component, and a redistribution structure disposed over the package component and the encapsulant. The package component includes a substrate, a protection structure, which includes an organic material, over a first surface of the substrate, and a multi-layered structure encapsulated by the protection structure. Sidewalls of the multi-layered structure are spaced apart from the encapsulant by the protection structure.