Package Structure Protruding Elements Prevent Bump Overflow
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Solution Overview
Problem
Existing package structures face issues with conductive bumps collapsing and overflowing during the reflow process, leading to poor electrical connection quality and reduced reliability due to small contact areas between planar conductive pads and bumps.
Innovation Solution
A package structure with protruding elements formed on the surface of the first circuit layer, where a semiconductor component is disposed on these elements through conductive elements that encapsulate three-dimensional contact surfaces, preventing material overflow and enhancing bonding through increased contact area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If planar conductive pads are used for bonding, then the manufacturing process is simple, but the contact area between conductive pads and conductive bumps is small, leading to poor bonding and reduced reliability
Solution Approach 1:
The patent transforms the planar (2D) conductive pad surface into a three-dimensional structure by forming protruding elements that extend upward from the pad surface. This dimensional change increases the contact area between the conductive pad and the conductive bump, improving bonding reliability without significantly complicating the manufacturing process.
2Reliability
If conventional reflow process is used, then the manufacturing process is simple, but conductive bumps collapse and conductive material overflows, adversely affecting electrical connection quality and causing short circuits
Solution Approach 1:
The patent applies preliminary anti-action by forming protruding elements on the conductive pads before the reflow process. These protruding elements prevent the collapse and overflow of conductive bumps during reflow by providing a structural framework that maintains proper bump formation, thereby preventing electrical connection defects without requiring additional process steps.
3Reliability
If conductive bumps are formed on planar pads, then the manufacturing process is simple, but the contact area is small, leading to poor bonding and reduced product reliability
Solution Approach 1:
The patent applies dimensionality change by creating protruding elements that extend vertically from the planar conductive pad surface. This transforms the bonding interface from a 2D planar contact to a 3D structure with increased surface area, improving product reliability while maintaining manufacturing simplicity.
Data Source
AI summary
A package structure is provided, which includes: a dielectric layer having opposite first and second surfaces; a first circuit layer embedded in the dielectric layer and having a surface exposed from the first surface of the dielectric layer; a plurality of conductive posts embedded in the dielectric layer and electrically connected to the first circuit layer and having one ends exposed from the second surface of the dielectric layer; a second circuit layer formed on the second surface of the dielectric layer and electrically connected the ends of the conductive posts exposed from the second surface of the dielectric layer; and a plurality of protruding elements formed on the surface of the first circuit layer exposed from the first surface of the dielectric layer, thereby providing a large contact area so as to strengthen bonding between a semiconductor chip and the first circuit layer of the package structure.