Package Structure With Recessed Substrate For Interconnection Density
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Solution Overview
Problem
Current package structures face challenges in achieving high die-to-die interconnection density due to the limitations of silicon interposers and flat substrate surfaces, leading to increased fabrication costs and complex manufacturing processes, as well as restricted flexibility in adjusting interconnection density.
Innovation Solution
A package structure design featuring a recessed region in one substrate to secure a second substrate, with conductive elements connecting dies to both substrates, allowing for increased signal transformation space and improved transmission efficiency by reducing circuit length, while maintaining the same area and volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a silicon interposer is inserted between dies and substrates to increase interconnection density, then the interconnection density is improved, but the volume and thickness of the package structure increase, and fabrication cost and manufacturing process complexity increase
Solution Approach 1:
The second substrate is embedded within a recessed region of the first substrate, creating a nested configuration where one substrate is partially contained within the other. This nesting approach increases interconnection density without proportionally increasing the overall package volume, as the second substrate utilizes the recessed space rather than adding to the external dimensions.
Solution Approach 2:
The invention transitions from a planar interconnection arrangement to a three-dimensional configuration by creating a recessed region in the first substrate and embedding the second substrate within it. This dimensional change allows for increased interconnection density by utilizing vertical space and depth, rather than only horizontal expansion.
2Quantity of substance
If a silicon interposer is inserted between dies and substrates to increase interconnection density, then the interconnection density is improved, but the fabrication cost and manufacturing process complexity increase
Solution Approach 1:
The nested configuration of the second substrate within the recessed region of the first substrate simplifies the manufacturing process by eliminating the need for complex silicon interposer fabrication and integration. The embedding approach can be achieved through standard substrate processing techniques, reducing overall manufacturing complexity while maintaining high interconnection density.
3Ease of manufacture
If a flip-chip process is used to connect the dies on a flat substrate surface, then the manufacturing process is simplified, but the density of interconnections is limited due to the flat surface
Solution Approach 1:
By creating a recessed region in the first substrate and embedding the second substrate within it, the invention transforms the flat two-dimensional mounting surface into a three-dimensional configuration. This allows for increased interconnection density by utilizing the vertical dimension and the depth of the recessed region, while still maintaining compatibility with flip-chip bonding processes.
Solution Approach 2:
The recessed region creates a localized area with different geometric properties compared to the surrounding flat substrate surface. This local modification allows for higher interconnection density in the recessed region while maintaining the overall simplicity of the manufacturing process, as only a specific area requires the embedding structure.
4Reliability
If the second substrate is embedded in a recessed region of the first substrate, then the space for signal transformation is increased and transmission efficiency is improved, but the structural complexity of the substrate increases
Solution Approach 1:
The nested configuration of the second substrate within the recessed region of the first substrate provides shortened signal paths and reduced circuit length for die-to-die interconnections. The embedding structure naturally creates more direct routing options and reduces the need for long trace lengths, improving transmission efficiency without requiring additional complex signal conditioning structures.
Data Source
AI summary
A package structure includes a first substrate, a second substrate, a plurality of dies, a plurality of first conductive elements, and a plurality of second conductive elements. The first substrate has a recessed region. The second substrate is disposed in the recessed region and protrudes from the first substrate. The dies are disposed on the first substrate and the second substrate, such that the second substrate is disposed between the first substrate and the dies. The first conductive elements are disposed between the dies and the first substrate. The dies are electrically connected with the first substrate through the first conductive elements. The second conductive elements are disposed between the dies and the second substrate. The dies are electrically connected with the second substrate through the second conductive elements.