Semiconductor Package Redistribution Structure with Conductive Pillars
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Solution Overview
Problem
Conventional semiconductor packaging technologies face challenges in achieving high integration density and reducing package size while minimizing area usage, particularly as feature sizes decrease, leading to increased risks of solder bridging due to higher input/output counts and reduced pitches.
Innovation Solution
The development of package structures with redistribution structures and external electrical connectors, including conductive pillars and solder, which allow for increased rigidity and reduced solder usage, enabling high-density interconnections with small pitches and minimizing bridging risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional semiconductor packaging is used with reduced feature sizes, then integration density improves, but solder bridging risk increases
Solution Approach 1:
The patent introduces conductive pillars that extend vertically through the encapsulant material, transitioning from planar interconnections to three-dimensional structures. This dimensional change allows electrical connections to pass through the encapsulant rather than along its surface, effectively separating the signal path from potential solder bridging paths and enabling higher I/O density without proportionally increasing bridging risk
Solution Approach 2:
The encapsulant material serves as an intermediary between the solder joints and the conductive pillars. By positioning the conductive pillars within the encapsulant and extending them to the surface, the structure creates a protected interconnection path that is shielded from external contaminants and mechanical stress, reducing solder bridging risk while maintaining high integration density
2Area of stationary object
If package size is reduced, then area usage improves, but manufacturing complexity increases
Solution Approach 1:
The patent combines multiple functions into the encapsulant material: it provides mechanical protection, electrical insulation, and structural support for the conductive pillars. By integrating these functions into a single component rather than using separate elements, the design achieves compact packaging without proportionally increasing overall structure complexity
Solution Approach 2:
The conductive pillars serve multiple functions simultaneously: they provide electrical interconnection, structural support, and define the packaging geometry. This multi-functionality allows the package to achieve high integration density in a compact form factor without requiring additional specialized components that would increase complexity
3Adaptability or versatility
If I/O counts are increased, then functionality improves, but solder bridging risk increases
Solution Approach 1:
By extending conductive pillars vertically through the encapsulant, the patent creates three-dimensional interconnection paths that are spatially separated from the solder joint plane. This allows multiple I/O connections to be packed densely without the solder pathways converging, enabling increased I/O counts while maintaining reliability by preventing solder bridging
Data Source
AI summary
Packages structure and methods of forming them are discussed. A structure includes a first die, a first encapsulant at least laterally encapsulating the first die, and a redistribution structure on the first die and the first encapsulant. The second die is attached by an external electrical connector to the redistribution structure. The second die is on an opposite side of the redistribution structure from the first die. A second encapsulant is on the redistribution structure and at least laterally encapsulates the second die. The second encapsulant has a surface distal from the redistribution structure. A conductive feature extends from the redistribution structure through the second encapsulant to the surface of the second encapsulant. A conductive pillar is on the conductive feature, and the conductive pillar protrudes from the surface of the second encapsulant.