Package Structure Integrating Reflow and Curing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing surface mounting technology (SMT) for electronic components is complex, leading to poor production yield and increased costs due to separate processes for reflowing conductive bumps and curing underfill, and results in an unsightly appearance from excess underfill exposure.
Innovation Solution
A package process where insulation paste is coated on conductive bumps before mounting, and both are processed in a single heating step to reflow the bumps and cure the paste, integrating the bonding and curing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate processes are used for reflowing conductive bumps and curing underfill, then bonding reliability is improved, but process complexity increases and production cost rises
Solution Approach 1:
The patent combines the reflow process for conductive bumps and the curing process for underfill into a single integrated heating step. The heating temperature is controlled to be above the melting point of the conductive bumps while also being sufficient to cure the underfill, eliminating the need for separate processes and reducing overall process complexity
2Reliability
If separate processes are used for reflowing conductive bumps and curing underfill, then bonding reliability is improved, but production cost increases
Solution Approach 1:
The patent merges two separate fabrication processes into one, which directly reduces the number of fabrication equipments needed. This consolidation lowers capital equipment costs, reduces labor requirements for process monitoring and adjustment, and decreases production time, thereby reducing overall production cost while maintaining bonding reliability
3Reliability
If underfill is dispensed outside the junction, then filling effectiveness is improved, but appearance quality deteriorates due to underfill exposure
Solution Approach 1:
The patent applies underfill to the conductive bumps before the mounting process. This preliminary application ensures that the underfill is already in position to effectively fill gaps and wrap around the conductive bumps during mounting, while the subsequent integrated heating process cures the underfill in place, preventing exposure and ensuring good appearance quality
4Manufacturing precision
If multiple fabrication equipments are used, then process control precision is improved, but productivity decreases
Solution Approach 1:
The patent integrates two separate fabrication processes into one, reducing the number of fabrication equipments required. This consolidation eliminates the need for multiple equipment setups, process transitions, and intermediate handling steps, thereby significantly improving production efficiency and throughput while maintaining adequate process control precision through optimized heating parameters
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This simplifies the process, reduces equipment and labor costs, and improves the appearance by preventing underfill exposure, thereby enhancing production efficiency and yield.
Implementation Method 1
a heating process is performed to the first conductive bumps and the first insulation paste, so that the first conductive bumps are reflowed to bond the first electronic component and the substrate pads
Implementation Method 2
the first insulation paste is cured
Data Source
AI summary
A package structure and a package process are provided. In the package process, firstly, a first electronic component having a plurality of first conductive bumps at a bottom thereof is provided. Then, a first insulation paste is coated on the first conductive bumps. The first electronic component is disposed on a circuit substrate having a plurality of substrate pads, and the first conductive bumps are respectively situated on the substrate pads. Next, a heating process is performed to both of the first conductive bumps and the first insulation paste, wherein the first conductive bumps is reflowed to bond the first electronic component and the substrate pads, and the first insulation paste is cured.