Semiconductor Package Reinforcing Blocks for Singulation Stress
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Solution Overview
Problem
High-capacity semiconductor memory devices face mechanical stress and cracking issues during singulation due to laser cutting and thermal conductivity challenges, particularly at curved and discontinuous points, which can damage electrical traces and semiconductor dies.
Innovation Solution
Incorporating reinforcing blocks on the substrate at mechanical stress points, such as the beginning and end of curved sections and discontinuities, to enhance strength and allow the use of low-strength, high-thermal-conductivity molding compounds, which are applied on the substrate's surface and remain in the device during singulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If high thermal conductivity molding compound is used, then heat dissipation is improved, but mechanical strength decreases causing cracking at stress points
Solution Approach 1:
The patent uses a composite structure combining reinforcing blocks made of high-strength material (such as metal or ceramic) with the molding compound. This composite approach allows the molding compound to provide high thermal conductivity while the reinforcing blocks provide the necessary mechanical strength to prevent cracking at stress points during laser cutting and singulation processes.
2Manufacturing precision
If laser cutting is used for curved portions, then manufacturing precision is improved, but mechanical stress increases causing substrate cracking
Solution Approach 1:
The patent places reinforcing blocks at predetermined mechanical stress points (such as curved portions and discontinuous points) before the laser cutting process. These pre-positioned reinforcing blocks are designed to withstand the mechanical stress generated during subsequent laser cutting and singulation operations, preventing substrate cracking while allowing precise cutting to proceed.
3Strength
If reinforcing blocks are added to prevent cracking, then mechanical strength is improved, but device complexity increases
Solution Approach 1:
The patent applies reinforcing blocks only at specific locations where mechanical stress is concentrated, such as curved portions and discontinuous points of the substrate outline, rather than uniformly across the entire substrate. This localized approach provides the necessary mechanical strength at critical stress points while minimizing the overall complexity and material usage of the package structure.
Data Source
AI summary
A semiconductor device includes a substrate, semiconductor dies on the substrate, molding compound and reinforcing blocks on the substrate. The reinforcing blocks may be provided at positions on the substrate where mechanical stresses develop in the device during singulation, such as at curves and/or discontinuous points around the outline of the substrate, to add strength to the substrate.