Semiconductor Package Resin Composition for Low-Warpage Prepreg Flow
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Solution Overview
Problem
Semiconductor packages face warpage issues due to differences in thermal expansion coefficients between chips and printed circuit boards, particularly during high-temperature processes, and existing solutions that reduce thermal expansion also compromise flowability.
Innovation Solution
A thermosetting resin composition for semiconductor packages is developed, incorporating an amine compound with specific functional groups, a thermosetting resin, a thermoplastic resin, and an inorganic filler, which maintains low glass transition temperature, low modulus, and low coefficient of thermal expansion while ensuring excellent flowability and minimizing warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the prepreg is filled with a high amount of filler to lower the coefficient of thermal expansion, then the coefficient of thermal expansion is reduced, but the flowability of the prepreg is reduced
Solution Approach 1:
The patent modifies the chemical composition parameters of the resin system by selecting specific epoxy resins with appropriate molecular weights and structures, and adjusting the amine compound-to-epoxy resin ratio. This allows achieving low CTE (≤12 ppm/°C.) without excessive filler content, thereby maintaining flowability. The glass transition temperature is controlled at 230°C or less through parameter optimization of the resin system.
Solution Approach 2:
The patent creates a composite resin system combining epoxy resin with specific amine compounds containing electron-withdrawing groups. This composite material approach allows the resin matrix itself to contribute to lowering CTE rather than relying solely on filler content. The synergistic interaction between the epoxy and amine components achieves both low CTE and good flowability.
2Weight of stationary object
If the thickness of the printed circuit board is decreased to meet performance requirements, then the weight and size are reduced, but the rigidity is reduced and warpage problems occur
Solution Approach 1:
The patent optimizes the resin system parameters to achieve a glass transition temperature of 230°C or less and storage modulus of 16 GPa or less. This parameter control allows the resin to remain flexible at operating temperatures, reducing thermal stress and warpage in thin boards while maintaining adequate rigidity for structural support.
Solution Approach 2:
The patent specifically addresses thermal expansion mismatch between the PCB and mounted chips by achieving a low coefficient of thermal expansion (≤12 ppm/°C.) through the resin composition. This reduces differential thermal stress during temperature cycling, preventing warpage in thin-board applications.
3Stability of the object's composition
If the glass transition temperature is lowered to reduce warpage, then the modulus is reduced and flowability improves, but the structural stability at high temperature may be compromised
Solution Approach 1:
The patent precisely controls the glass transition temperature parameter to be 230°C or less by adjusting the resin system composition, specifically the amine compound-to-epoxy resin ratio and selecting appropriate amine compounds with electron-withdrawing groups. This parameter optimization achieves the desired balance between flexibility for flowability and thermal stability for structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves a glass transition temperature of 230°C or less, a storage modulus of 16 GPa or less, and a coefficient of thermal expansion of 12 ppm/°C or less, reducing warpage and enhancing mechanical properties and flowability in semiconductor packages.
Implementation Method 1
a thermosetting resin composition for a semiconductor package including an amine compound containing one or more of at least one kind of functional group selected from the group consisting of a sulfone group; a carbonyl group
Implementation Method 2
an inorganic filler, wherein a glass transition temperature is 230° C. or less
Data Source
AI summary
The present disclosure relates to a thermosetting resin composition for a semiconductor package including an amine compound containing a specific functional group, a thermosetting resin, a thermoplastic resin, and an inorganic filler, and having a glass transition temperature of 230° C. or less after curing, a prepreg including the thermosetting resin composition, and a metal clad laminate including the prepreg.