Semiconductor Package Ring Riveting Against Thermal Delamination
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Solution Overview
Problem
Existing semiconductor packaging structures face challenges in preventing delamination of adhesive layers during thermal cycling and in efficiently managing stress within the package, which can affect the reliability of the semiconductor package.
Innovation Solution
The use of riveting structures formed between a lower ring and an upper ring in the semiconductor package, which eliminates the need for an additional adhesive layer and allows direct connection of the rings. These riveting structures include protruding parts and matching recessed parts on adjacent surfaces, which help in relieving stress and preventing delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive layers are used to connect rings in semiconductor packages, then ease of manufacture is improved, but reliability deteriorates due to delamination during thermal cycling
Solution Approach 1:
The patent removes the adhesive layer from the connection between the first ring and second ring, eliminating the source of delamination during thermal cycling. The rings are directly connected through mechanical engagement features (protrusions and recesses) formed on the rings themselves, extracting the problematic adhesive component while maintaining structural integrity.
Solution Approach 2:
The patent replaces the chemical bonding mechanism (adhesive) with a mechanical bonding mechanism (direct mechanical engagement through protrusions and recesses). This substitution eliminates the delamination issue associated with adhesive layers during thermal cycling while maintaining ease of manufacture through direct structural integration.
2Device complexity
If adhesive layers are used to connect rings, then device complexity is reduced, but stress management deteriorates leading to delamination
Solution Approach 1:
The patent introduces localized mechanical engagement features (protrusions and recesses) at specific locations on the rings to manage stress. These features are strategically positioned to provide stress relief and prevent delamination during thermal cycling, applying local quality enhancement rather than uniform structural modification.
Solution Approach 2:
The patent creates a composite structure where the two rings are mechanically integrated through protrusion-recess engagement, forming a unified stress-management system. This composite approach allows the structure to handle thermal expansion and contraction stresses more effectively than separate rings with adhesive bonding.
3Reliability
If riveting structures are implemented between rings, then reliability is improved by preventing delamination, but device complexity increases
Solution Approach 1:
The patent merges the structural functions of the two rings by directly connecting them through integrated protrusion and recess features. This merging eliminates the need for separate adhesive layers and associated alignment structures, reducing overall device complexity while improving reliability through direct mechanical bonding.
Solution Approach 2:
The protrusion and recess features serve multiple functions: they provide mechanical connection between rings, manage stress during thermal cycling, and prevent delamination. This multi-functionality reduces the need for additional components, thereby improving reliability without proportionally increasing device complexity.
Data Source
AI summary
A semiconductor package and a method of forming the same are provided. The semiconductor package includes a package substrate and a semiconductor device mounted on the surface of the package substrate. A first ring is disposed over the surface of the package substrate and surrounds the semiconductor device. A second ring is disposed over the top surface of the first ring. Also, a protruding part and a matching recessed part are formed on the top surface of the first ring and the bottom surface of the second ring, respectively. The protruding part extends into and engages with the recessed part to connect the first ring and the second ring. An adhesive layer is disposed between the surface of the package substrate and the bottom surface of the first ring for attaching the first ring and the overlying second ring to the package substrate.