Semiconductor Package Ring Adhesive Layout for Warpage Control
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Solution Overview
Problem
As semiconductor devices with increased integration density face warpage issues due to large substrate sizes, leading to difficulties in maintaining planarity and potential damage from stress-induced delamination and cracking caused by coefficient of thermal expansion mismatches, existing packaging technologies struggle to effectively manage these challenges.
Innovation Solution
A semiconductor device design that incorporates a ring attached to the substrate using multiple types of adhesive materials with varying elastic properties to alleviate stress and improve planarity, where a softer, more elastic adhesive is used at corners and a stiffer adhesive elsewhere, and optionally a sacrificial adhesive is used that can be removed post-attachment to enhance structural support and reduce warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a large substrate size is used to accommodate increased integration density, then more components can be integrated, but warpage and stress-induced delamination occur
Solution Approach 1:
The patent applies local quality by using different adhesive materials with different elastic moduli at different locations on the substrate. Specifically, a first adhesive material with a first elastic modulus is used in a first region, while a second adhesive material with a second elastic modulus is used in a second region. This spatial variation in material properties allows the substrate to maintain planarity across its large area while accommodating thermal expansion differences, thereby preventing warpage and stress-induced delamination.
2Quantity of substance
If a large substrate size is used to accommodate increased integration density, then more components can be integrated, but stress-induced delamination and cracking occur
Solution Approach 1:
The patent applies local quality by using different adhesive materials with different elastic moduli at different locations on the substrate. Specifically, a first adhesive material with a first elastic modulus is used in a first region, while a second adhesive material with a second elastic modulus is used in a second region. This spatial variation in material properties allows the substrate to maintain planarity across its large area while accommodating thermal expansion differences, thereby preventing warpage and stress-induced delamination.
3Stability of the object's composition
If multiple types of adhesive materials are used to reduce stress and improve planarity, then warpage and delamination are prevented, but the attachment process becomes more complex
Solution Approach 1:
The patent applies segmentation by dividing the substrate into multiple regions (first region and second region) and applying different adhesive materials to each region. This segmentation allows the complex requirement of managing stress across a large substrate to be broken down into manageable regional applications, where each region's adhesive material is optimized for its specific location's stress and thermal expansion requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces stress-induced damage, maintains planarity, and facilitates easier bonding of the semiconductor device to other components, thereby preventing delamination and cracking while improving the attachment process.
Implementation Method 1
an adhesive material between the ring and the substrate, wherein the adhesive material comprises a first adhesive material disposed under corners of the ring and comprises a second adhesive material disposed between the first adhesive material, the first adhesive material having different composition from the second adhesive material
Data Source
AI summary
A method of forming a semiconductor device includes applying an adhesive material in a first region of an upper surface of a substrate, where applying the adhesive material includes: applying a first adhesive material at first locations of the first region; and applying a second adhesive material at second locations of the first region, the second adhesive material having a different material composition from the first adhesive material. The method further includes attaching a ring to the upper surface of the substrate using the adhesive material applied on the upper surface of the substrate, where the adhesive material is between the ring and the substrate after the ring is attached.