Semiconductor Package Ring Structure for Corner Warpage Relief
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Solution Overview
Problem
Existing semiconductor device packaging structures face issues with stress concentration and warpage at the corners of the substrate due to thermal expansion mismatch and mechanical coupling effects, which affect reliability and connectivity to external devices.
Innovation Solution
A ring structure with thinner corner parts than the rest of the structure is used to reduce mechanical coupling and thermal expansion mismatch, alleviating stress concentration and warpage by incorporating recesses at the corners, thereby enhancing the reliability and connectivity of the semiconductor device package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional ring structure is used to support the substrate, then mechanical strength is improved, but stress concentration and warpage occur at the corners due to thermal expansion mismatch
Solution Approach 1:
The ring structure is designed with non-uniform thickness, where the corner portions have reduced thickness compared to the mid-section. This local variation in geometry allows the corners to accommodate thermal expansion mismatch and reduce stress concentration, while the thicker mid-section maintains overall mechanical strength. The adhesive layer thickness is also varied, being thicker at corners and thinner at the mid-section, further optimizing stress distribution.
Solution Approach 2:
The patent modifies the geometric parameters of the ring structure, specifically the thickness distribution, to optimize performance. By reducing corner thickness and increasing mid-section thickness, the structure adapts to different functional requirements: corners need flexibility for thermal expansion while the mid-section needs rigidity for mechanical support. This parameter optimization resolves the contradiction between strength and stress concentration.
2Stability of the object's composition
If the ring structure is made thicker to reduce warpage, then mechanical coupling effect increases, but thermal expansion mismatch at corners worsens
Solution Approach 1:
The ring structure employs local quality variation with different thicknesses at different locations. The mid-section has greater thickness to provide warpage control and mechanical stability, while the corner portions have reduced thickness to minimize thermal expansion mismatch. This spatially differentiated design allows each region to optimize for its specific functional requirement.
Solution Approach 2:
The ring structure can be viewed as segmented into distinct regions: corner portions and mid-section portions, each with optimized thickness. This segmentation allows independent optimization of each region's properties to address different functional requirements simultaneously, resolving the contradiction between warpage control and thermal expansion accommodation.
3Ease of manufacture
If uniform adhesive layer is applied across the ring structure, then manufacturing is simplified, but stress distribution is non-optimal at corners
Solution Approach 1:
The adhesive layer is designed with non-uniform thickness, being thicker at the corner portions and thinner at the mid-section. This local variation in adhesive properties compensates for the stress concentration that would otherwise occur at the corners, improving reliability while the manufacturing process can still be relatively simple using standard dispensing techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces warpage and stress concentration at the corners of the substrate, improving the reliability and connectivity of the semiconductor device package to external electronic devices.
Implementation Method 1
stress concentration and warpage at the corners of the substrate due to thermal expansion mismatch and mechanical coupling effects
Data Source
AI summary
A semiconductor device package and a method of forming the same are provided. The semiconductor device package includes a substrate, an electronic component, a ring structure, and an adhesive layer. The electronic component is located over a surface of the substrate. The ring structure is located over the surface of the substrate and surrounding the electronic component. The ring structure has a bottom surface facing the surface of the substrate and a top surface opposite the bottom surface. The ring structure includes recesses recessed from and located on the top surface, wherein the recesses are arranged corresponding to the corners of the substrate. The adhesive layer is interposed between the bottom surface of the ring structure and the surface of the substrate.