Package Riser and Clamp Assembly for Solderless Device Exchange
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Solution Overview
Problem
The need to minimize or eliminate the use of customized platforms for exchanging device packages during validation, debugging, or replacement, as customized platforms occupy valuable space and require additional labor and time in production, and existing solutions involve breaking and reflowing solder contacts for device package replacement.
Innovation Solution
A package assembly that includes a package riser with a footprint corresponding to the device package, allowing for compact installation and easy exchange without breaking solder contacts, using a package clamp and riser flange to maintain mechanical and electrical coupling, enabling the reuse of device packages across platforms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If customized platforms with socketed interfaces are used for device package exchange, then ease of operation is improved, but device complexity and area of stationary object worsen
Solution Approach 1:
The platform is segmented into a standard base platform and a separate removable package assembly. The package assembly includes the interface frame, device package, and fasteners as discrete components that can be removed and replaced without modifying the base platform. This allows the platform to maintain standard dimensions while enabling easy package exchange through modular assembly replacement.
Solution Approach 2:
The customized interface components (interface frame, back plate, fastener orifices) are extracted from the standard platform design and consolidated into a separate removable package assembly. This extraction allows the base platform to maintain its standard footprint while the specialized interface functionality is contained in the interchangeable package assembly that sits on top of the standard platform.
2Ease of operation
If customized platforms are used for device package exchange, then ease of operation is improved, but productivity worsens due to additional labor and time
Solution Approach 1:
By segmenting the platform into a standard base and removable package assembly, the invention enables rapid package exchange without requiring labor-intensive soldering operations. The package assembly can be pre-assembled with all necessary components (interface frame, device package, fasteners) and installed as a single unit, significantly reducing assembly time and labor requirements compared to traditional solder-based methods.
Solution Approach 2:
The package assembly is prepared in advance with all components pre-positioned and pre-assembled. The interface frame, back plate, and fasteners are configured before installation on the platform, allowing for quick deployment and exchange without requiring time-consuming on-site assembly or soldering operations during production.
3Ease of repair
If solder contacts are broken and reflowed for device package replacement, then ease of repair is improved, but loss of time and productivity worsen
Solution Approach 1:
The soldering operation is extracted from the package replacement process entirely. Instead of breaking and reflowing solder contacts to replace device packages, the invention uses mechanical fasteners that allow for tool-free or simple tool-based removal and installation. This eliminates the time-consuming solder reflow process while maintaining secure electrical and mechanical connections.
Solution Approach 2:
The solder-based mechanical connection system is replaced with a fastener-based mechanical connection system. The package assembly uses screws, clips, or other removable fasteners to secure the device package to the interface frame, substituting the permanent solder joint with a reversible mechanical fastening mechanism that enables rapid replacement without thermal processing.
4Device complexity
If standard platform design is maintained for both debugging and production, then device complexity is reduced, but adaptability worsens without customized interfaces
Solution Approach 1:
The package assembly serves multiple functions: it provides the customized interface frame and back plate for device package mounting, contains the necessary fasteners for secure attachment, and acts as a removable unit that can be exchanged between debugging and production platforms. This multi-functional design allows a single standardized package assembly to work across different platform types without requiring platform-specific customization.
Solution Approach 2:
The interface functionality is segmented into a separate removable package assembly that can be transferred between different base platforms. This segmentation allows the standard platform to maintain its simplicity while the specialized interface components are contained in the interchangeable package assembly, enabling adaptability without increasing base platform complexity.
Data Source
AI summary
A package assembly includes a device package having a package perimeter footprint. A package riser is coupled with the device package. The package riser includes a riser body having a riser perimeter footprint corresponding to the package perimeter footprint. The riser body includes a package face coupled with the device package and an opposed platform face. A riser flange is proximate to the package face. The riser flange extends from the riser body. A package clamp is coupled with the device package and the package riser. The package clamp includes a clamp face coupled with the device package, and one or more clamp legs clamped to the riser flange. The device package is clamped between the clamp face and the package face.