Semiconductor Package Screw Assembly for Heat Dissipation Stability

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Solution Overview

Problem

The semiconductor industry faces challenges in achieving compact and efficient packaging of semiconductor dies due to limitations in current integration density and thermal management techniques, particularly in the assembly of integrated fan-out packages with heat spreaders and sinks.

Innovation Solution

A package structure is developed that includes a semiconductor package with a redistribution structure, a buffer element, and a thermal interface material, where the package is secured by screws with an anti-loosening coating and washers, allowing for effective thermal dissipation and mechanical stability, while maintaining compactness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If integrated fan-out packages are assembled with heat spreaders and heat sinks to improve thermal management, then heat dissipation capability is improved, but device complexity and assembly difficulty increase

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidassembly complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent combines the heat spreader and heat sink into a single integrated thermal management component. The heat spreader is formed as an integral part of the heat sink structure, eliminating the need for separate assembly steps and reducing overall device complexity while maintaining effective heat dissipation capability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated thermal management structure serves multiple functions simultaneously: it acts as both a heat spreader to distribute thermal load and a heat sink to dissipate heat. This multi-functional design reduces the number of components needed and simplifies the overall package assembly.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Quantity of substance

If minimum feature size is reduced to increase integration density, then integration density is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improveintegration densityVSAvoidfeature size precision

Core Design Contradiction:

Quantity of substanceVSManufacturing precision

Solution Approach 1:

The patent employs advanced lithography techniques and adjusts process parameters to achieve precise patterning at reduced feature sizes. By optimizing exposure conditions, development parameters, and etch profiles, the manufacturing process maintains high precision even as minimum feature dimensions are reduced to increase integration density.

Inventive Principle:

Principle #35Parameter changes

3Strength

If screws are used to secure the package structure for mechanical stability, then mechanical strength is improved, but screw loosening over time may occur

Engineering Contradiction:

Improvemechanical stabilityVSAvoidscrew retention

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The patent incorporates anti-loosening features directly into the screw design and assembly structure. Threadlocking compounds or deformation features are applied in advance during the assembly process to prevent future loosening, ensuring long-term mechanical stability without requiring additional maintenance or adjustment.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent introduces washers or threadlocking compounds as intermediary elements between the screws and the package structure. These intermediaries provide additional friction or mechanical interference to prevent screw rotation and loosening, thereby maintaining reliable mechanical fastening over the device lifetime.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances thermal conductivity and mechanical stability, preventing screw loosening and ensuring efficient heat dissipation across the semiconductor package, thereby addressing the need for compact and reliable thermal management in integrated fan-out packages.

Implementation Method 1

This configuration enhances thermal conductivity and mechanical stability, preventing screw loosening and ensuring efficient heat dissipation across the semiconductor package

Methodology Applied

Scientific EffectThermal conductivity: Conduction (thermal)

Implementation Method 2

The external thread of the screw is engaged to the internal thread of the top plate, and the anti-loosening coating is adhered between the external thread and the internal thread

Methodology Applied

Scientific EffectFriction: Friction

Implementation Method 3

the anti-loosening coating is adhered between the external thread and the internal thread

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS11749582B2Package structure

Publication Date: 2023.09.05 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A package structure includes a bottom plate, a semiconductor package, a top plate, a screw and an anti-loosening coating. The semiconductor package is disposed over the bottom plate. The top plate is disposed over the semiconductor package, and includes an internal thread in a screw hole of the top plate. The screw penetrates through the bottom plate, the semiconductor package and the top plate, and includes an external thread. The external thread of the screw is engaged to the internal thread of the top plate, and the anti-loosening coating is adhered between the external thread and the internal thread.