Semiconductor Package Sealing Structure for Delamination Prevention
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Solution Overview
Problem
The semiconductor industry faces challenges in manufacturing smaller packaging structures for integrated circuits, particularly in ensuring reliable connections and preventing delamination and moisture penetration in 3D packaging, which affects the yield and cost-effectiveness of the process.
Innovation Solution
A method involving the formation of through integrated fan-out vias (TIVs) and redistribution lines (RDLs) with conductive bumps, where sealing structures are dispensed around the conductive bumps to prevent delamination and moisture penetration, eliminating the need for under bump metallization (UBM) structures, thereby reducing manufacturing costs and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging methods are used for smaller semiconductor packages, then manufacturing processes become more complex and costly, but reliability and yield are compromised due to delamination and moisture penetration issues
Solution Approach 1:
The patent removes the under bump metallization (UBM) layer from the conventional packaging structure. By eliminating this intermediate layer, the design simplifies the manufacturing process while maintaining reliable electrical connections through direct bonding of conductive bumps to the redistribution lines, thus resolving the contradiction between reliability and manufacturing complexity
Solution Approach 2:
The patent introduces sealing structures that segment the package into protected regions around each conductive bump. These sealing structures create isolated chambers that prevent moisture penetration and delamination, improving reliability without requiring complex UBM structures, thereby addressing the contradiction between reliability and manufacturing complexity
2Reliability
If UBM structures are used to ensure reliable connections, then manufacturing costs increase and process complexity increases, but connection reliability is improved
Solution Approach 1:
The patent eliminates the UBM layer entirely, removing the source of manufacturing complexity and cost. Direct bonding of conductive bumps to redistribution lines achieves reliable connections without the expensive multi-layer metallization process, resolving the contradiction between connection reliability and manufacturing cost
Solution Approach 2:
The patent replaces the expensive, complex UBM structure with simpler, more cost-effective conductive bumps and sealing structures. The sealing structures provide adequate protection without the need for elaborate metallization, achieving reliable connections at lower manufacturing cost
3Area of stationary object
If smaller package sizes are used to increase integration density, then area is reduced, but manufacturing becomes more difficult with increased risk of delamination and moisture penetration
Solution Approach 1:
The patent addresses the two-dimensional area constraint by introducing a third dimension through vertical sealing structures. These sealing structures rise from the package surface to create protective barriers, enabling small footprint packages to maintain high reliability by blocking moisture and preventing delamination in the vertical dimension
Solution Approach 2:
The patent uses thin sealing structures that conform to the package surface and wrap around conductive bumps. These flexible sealing films provide effective moisture barriers and delamination prevention without adding significant area, allowing small packages to maintain high reliability
Data Source
AI summary
A package structure includes a semiconductor device, a first redistribution line, a dielectric layer, a first conductive bump and a first sealing structure. The dielectric layer is over the first redistribution line and has a first opening therein. The first conductive bump is partially embedded in the first opening and electrically connected to the first redistribution line. The first sealing structure surrounds a bottom portion of the first conductive bump. The first sealing structure has a curved surface extending from an outer surface of the bottom portion of the first conductive bump to a top surface of the dielectric layer.