Flexible Package Sealing with Localized Sealant at Fold Voids

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Solution Overview

Problem

Existing packaging materials with heat sealant layers often have voids at folds, which compromise seal strength and integrity, and using thicker sealant layers to mitigate this issue can increase costs and hinder recyclability.

Innovation Solution

Applying localized sealant material in discrete locations adjacent folds within the packaging material, which fills voids and enhances seal integrity without increasing overall thickness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a thicker heat sealant layer is used to fill voids at folds, then seal strength and integrity are improved, but manufacturing cost increases and recyclability is hindered

Engineering Contradiction:

Improveseal strengthVSAvoidsealant material quantity

Core Design Contradiction:

StrengthVSQuantity of substance

Solution Approach 1:

The patent applies sealant material locally only at discrete locations where folds occur, rather than using a uniformly thick sealant layer across the entire package. This localized application fills voids at critical fold areas while maintaining thin sealant layers in non-fold areas, thereby improving seal strength where needed without unnecessarily increasing overall material quantity, cost, or impacting recyclability.

Inventive Principle:

Principle #3Local quality

2Reliability

If a thicker heat sealant layer is used to eliminate voids, then seal integrity is improved, but the package becomes less suitable for recycling

Engineering Contradiction:

Improveseal integrityVSAvoidrecyclability

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

By concentrating sealant material only at discrete fold locations rather than applying it uniformly across the entire package surface, the invention maintains high seal integrity at critical areas while keeping the overall sealant quantity low. This allows the package to meet recyclability requirements that mandate specific percentages of base material, as the localized application does not unnecessarily cover large portions of the film with sealant material.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The localized sealant material effectively fills voids, improving seal strength and integrity while maintaining recyclability and reducing material costs.

Implementation Method 1

The localized sealant material at least partially fills voids adjacent the folds

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentEP4054954B1Package with improved sealing and method of making

Publication Date: 2025.12.17 INTERCONTINENTAL GREAT BRANDS LLC

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AI summary

A package is provided that is formed from a packaging material, such as film, having increased adhesive in critical locations, such as adjacent folds in the end seal and other areas so that that the increased adhesive can at least partially fill voids adjacent such folds. The additional, localized sealant material is applied in a plurality of discrete locations in the end seal or other region adjacent where folds are formed and overlap with a sealant layer so as to provide additional sealant material for at least partially filling the voids without being present throughout the entirety, majority or large portions of the packaging material.