Selective Corrosion Protection in Electronic Package Connections
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Solution Overview
Problem
Electronic packages, especially those used in harsh or corrosive environments, have a limited lifespan due to corrosion issues that existing protective measures cannot effectively address over time.
Innovation Solution
A package design featuring a carrier with an encapsulant that exposes part of the carrier for both electric connection and corrosion protection structures, where the corrosion protection structure is made of a less noble metal than the electric connection structure, ensuring efficient corrosion protection while maintaining electrical connectivity by keeping both structures partially exposed outside the encapsulant.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electric connection structure is fully exposed outside the encapsulant for electrical connectivity, then electrical reliability is improved, but corrosion resistance deteriorates
Solution Approach 1:
A corrosion protection structure made of less noble metal is introduced as an intermediary between the electric connection structure and the corrosive environment. This intermediate layer sacrifices itself through galvanic corrosion to protect the underlying electric connection structure, allowing the lead to remain partially exposed for electrical connectivity while being protected from corrosion.
Solution Approach 2:
The lead is constructed as a composite structure with at least two different metals: a more noble metal (e.g., copper) providing electrical conductivity and a less noble metal (e.g., zinc or aluminum) providing corrosion protection. This composite approach allows simultaneous achievement of electrical reliability and corrosion resistance through the synergistic combination of different metal properties.
2Object-affected harmful factors
If the electric connection structure is fully enclosed by encapsulant for protection, then corrosion resistance is improved, but electrical connectivity deteriorates
Solution Approach 1:
The encapsulant selectively covers only specific portions of the lead structure - the corrosion protection structure is partially enclosed while the electric connection structure remains exposed. This localized differentiation allows the encapsulant to provide corrosion protection where needed while maintaining electrical connectivity at the exposed connection points.
3Object-affected harmful factors
If a corrosion protection structure is added to protect the electric connection structure, then corrosion resistance is improved, but device complexity increases
Solution Approach 1:
The corrosion protection structure and electric connection structure are merged into a single integrated lead component rather than being separate parts. The different metal layers are combined during manufacturing (e.g., through electroplating or co-extrusion) to form a unified structure that provides both electrical connectivity and corrosion protection simultaneously, reducing overall device complexity.
Solution Approach 2:
The lead structure serves multiple functions simultaneously: the more noble metal provides electrical conductivity while the less noble metal provides corrosion protection. This multi-functional design eliminates the need for separate protective components, maintaining simplicity while achieving both electrical and corrosion protection requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly enhances the corrosion stability and electrical reliability of the package, particularly in corrosive environments, by using a sacrificial anode mechanism where the corrosion protection structure corrodes instead of the electric connection structure, thus extending the package's lifespan.
Implementation Method 1
the corrosion protection structure is made of a less noble metal than the electric connection structure, ensuring efficient corrosion protection while maintaining electrical connectivity by keeping both structures partially exposed outside the encapsulant
Data Source
AI summary
A package is disclosed. In one example, the package comprises a carrier, an electronic component mounted on the carrier, and an encapsulant encapsulating at least part of the electronic component and only part of the carrier so that another exposed part of the carrier is exposed with regard to the encapsulant. The exposed part of the carrier comprises an electric connection structure and a corrosion protection structure. One of the electric connection structure and the corrosion protection structure is selectively formed on only a sub-portion of the other one of the electric connection structure and the corrosion protection structure outside of the encapsulant.