Semiconductor Package Shield Cap for EMI and Heat Dissipation
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Solution Overview
Problem
Conventional methods for forming EMI shields and heat spreaders in semiconductor devices are complex, leading to high costs and low reliability, and there is a need for a more efficient and cost-effective solution.
Innovation Solution
A method involving a package substrate with preformed conductive blocks and electronic components, encapsulated by an encapsulant, and a heat dissipation cap that is electrically and thermally coupled to the conductive blocks, forming an enclosed structure for EMI shielding and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional methods are used to form EMI shield and heat spreader, then EMI shielding and heat dissipation functions are achieved, but manufacturing complexity increases and cost rises
Solution Approach 1:
The patent combines the EMI shield and heat spreader into a single integrated component. The EMI shield serves dual purposes: providing electromagnetic interference shielding and acting as a heat dissipation structure. This merging eliminates the need for separate EMI shield and heat spreader components, thereby reducing manufacturing process complexity while maintaining both EMI shielding and heat dissipation functions.
Solution Approach 2:
The EMI shield is designed to perform multiple functions simultaneously: it provides electromagnetic interference shielding, serves as a heat spreader, and acts as a structural support element. This multi-functionality reduces the overall number of components needed in the semiconductor device packaging, simplifying the manufacturing process while achieving the required EMI shielding and heat dissipation effectiveness.
2Reliability
If conventional methods are used to form EMI shield and heat spreader, then EMI shielding and heat dissipation functions are achieved, but manufacturing cost increases
Solution Approach 1:
By merging the EMI shield and heat spreader into one integrated component, the patent reduces the number of separate manufacturing steps, material purchases, and assembly operations required. This consolidation directly lowers manufacturing costs while maintaining the effectiveness of both EMI shielding and heat dissipation functions.
Solution Approach 2:
The multi-functional EMI shield reduces the total bill of materials by eliminating redundant components. Instead of purchasing and assembling separate EMI shield and heat spreader parts, the design uses a single component that performs both functions, thereby reducing material costs and manufacturing expenses.
3Ease of manufacture
If conventional methods are used to form EMI shield and heat spreader, then EMI shielding and heat dissipation functions are achieved, but reliability decreases
Solution Approach 1:
The integrated EMI shield and heat spreader reduces the number of interfaces and connection points between components. By eliminating the interface between a separate EMI shield and heat spreader, the design reduces potential failure points such as bonding defects, misalignment, or thermal interface issues, thereby improving overall device reliability while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces manufacturing costs and enhances the reliability of semiconductor devices by providing effective EMI shielding and heat dissipation through a cost-effective, integrated structure.
Implementation Method 1
the conductive block and the heat dissipation cap form an enclosed structure to accommodate the electronic component
Implementation Method 2
thermally couple the heat dissipation cap to the electronic component
Data Source
AI summary
A semiconductor device and a method for forming the same are provided. The method includes: providing a package substrate; mounting at least one preformed conductive block and at least one electronic component on a top surface of the package substrate, wherein the preformed conductive block includes an insulating substrate and at least one conductive pillar extending through the insulating substrate; forming an encapsulant on the top surface of the package substrate, wherein the encapsulant exposes a top surface of the conductive pillar of the conductive block and a top surface of the electronic component; and forming a heat dissipation cap on the encapsulant to electrically couple the heat dissipation cap to the conductive pillar of the conductive block and to thermally couple the heat dissipation cap to the electronic component.