Semiconductor Package Shield Layer Formation Without Circuit Wraparound
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Solution Overview
Problem
The increased density and narrower wiring pitch in semiconductor packages lead to adverse effects from impedance and signal interference, necessitating efficient methods to form functional layers like electromagnetic wave shields without wrapping around circuit surfaces.
Innovation Solution
A method involving temporary fixing material layers, adhesive films, and support carriers to arrange semiconductor packages with controlled spacing for forming functional layers, such as electromagnetic wave shields, while preventing wrapping around circuit surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor packages are arranged with narrow spacing to increase density, then productivity and integration are improved, but signal interference and impedance increase adversely affect performance
Solution Approach 1:
An electromagnetic wave shield layer is introduced as an intermediary between adjacent semiconductor packages and between signal lines. This shield layer, formed by sputtering or vapor deposition, acts as a mediator that blocks electromagnetic interference while allowing the packages to maintain narrow spacing for high integration. The shield layer is applied to the adhesive film or sealing material surface, creating a protective barrier that enables dense packaging without performance degradation.
2Object-affected harmful factors
If a functional layer is formed directly on the semiconductor package surface, then electromagnetic shielding is improved, but material wrapping around the circuit surface causes defects
Solution Approach 1:
The electromagnetic wave shield layer is formed on the adhesive film or sealing material surface before the semiconductor package is fully assembled and cured. By performing the coating operation in advance, on the planar surface of the adhesive film, the material is deposited uniformly without risk of wrapping around the three-dimensional circuit surface. After curing, the pre-formed shield layer remains properly positioned without causing short circuits or manufacturing defects.
Solution Approach 2:
Instead of forming the functional layer on the vertical three-dimensional surface of the cured semiconductor package, the process transfers the coating operation to the two-dimensional planar surface of the adhesive film before assembly. This dimensional change from vertical to horizontal surface coating eliminates the wrapping problem while maintaining effective electromagnetic shielding coverage.
3Object-affected harmful factors
If sputtering or vapor deposition is used to form electromagnetic wave shield layers, then shielding performance is improved, but the process complexity and manufacturing time increase
Solution Approach 1:
The formation of the electromagnetic wave shield layer is merged with the existing adhesive film processing steps. The shield layer is deposited on the adhesive film surface as part of the package assembly process, rather than as a separate post-assembly operation. This integration combines multiple functions (adhesion and electromagnetic shielding) into a single unified process step, reducing overall manufacturing complexity despite using sputtering or vapor deposition technology.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables stable formation of functional layers on semiconductor packages with controlled thickness and spacing, effectively suppressing interference and enhancing electrical connectivity.
Implementation Method 1
After the step (A), curing the temporary fixing material layer may be performed by ultraviolet irradiation or heat treatment.
Implementation Method 2
The adhesive film for semiconductor devices is manufactured through a step of forming an electromagnetic wave shield layer on the surface of the adhesive layer by using a sputtering method or a vapor deposition method.
Implementation Method 3
The adhesive film for semiconductor devices is manufactured through a step of forming an electromagnetic wave shield layer on the surface of the adhesive layer by using a sputtering method or a vapor deposition method.
Data Source
AI summary
A method for manufacturing a semiconductor package, the method includes: (A) forming a temporary fixing material layer on the first surface (circuit exposed surface) of a panel member including a plurality of semiconductor packages, (B) attaching an adhesive film to the second surface of the panel member; (C) singulating the panel member and the temporary fixing material layer on the adhesive film to obtain a plurality of temporary fixing material piece-attached semiconductor packages; (D) arranging a plurality of the temporary fixing material piece-attached semiconductor packages on a support carrier so that the distance between the adjacent temporary fixing material piece-attached semiconductor packages is 0.1 mm or more; (E) peeling off the first adhesive film from the support carrier and the plurality of temporary fixing material piece-attached semiconductor packages; and (F) forming a functional layer on surfaces of the plurality of temporary fixing material piece-attached semiconductor packages.