Semiconductor Package Shielding Structure for Uniform EMI Coverage
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Solution Overview
Problem
Existing electromagnetic shielding solutions for semiconductor packaging structures suffer from inhomogeneous shielding layer thickness and poor edge coverage, leading to inadequate shielding performance.
Innovation Solution
A packaging structure and fabrication method involving a first shielding layer covering non-functional surfaces and sidewalls of semiconductor chips, followed by a second shielding layer formed on top of the first layer to ensure complete coverage and improved shielding performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single shielding layer is formed on semiconductor chips, then the shielding process is simple and fast, but the shielding layer has inhomogeneous thickness and poor edge coverage leading to inadequate shielding performance
Solution Approach 1:
The shielding layer is divided into multiple segments (first shielding layer and second shielding layer) that are formed sequentially. Each layer has specific thickness requirements and coverage areas, with the second layer specifically targeting edge regions to complement the first layer, thereby achieving uniform thickness and complete coverage while maintaining manufacturing feasibility
Solution Approach 2:
The first shielding layer is formed preliminarily to provide base coverage, followed by the second shielding layer that specifically addresses edge coverage deficiencies. This preliminary action approach ensures that each layer serves a specific purpose, with the second layer compensating for the limitations of the first layer before final encapsulation
2Object-affected harmful factors
If a single shielding layer is used, then the manufacturing process is simple, but the edge coverage is poor resulting in inadequate EMI protection
Solution Approach 1:
Different regions of the shielding structure are assigned different qualities: the first shielding layer provides general coverage with specific thickness, while the second shielding layer is specifically applied to edge regions to enhance coverage. This local differentiation ensures that each area receives the appropriate shielding quality needed for its function
Solution Approach 2:
The shielding approach transitions from a single-layer two-dimensional coverage to a multi-layer three-dimensional structure. The second shielding layer is applied at a different dimensional level (on top of the first layer) to specifically address edge regions, creating comprehensive coverage that accounts for both planar and vertical dimensions
Data Source
AI summary
A packaging structure and fabrication method thereof are provided. The method includes: providing semiconductor chips including functional surfaces, non-functional surfaces, and first soldering pads; providing electronic devices that do not need shielding including second soldering pads; providing a carrier plate; adhering functional surfaces of the semiconductor chips to the carrier plate; forming a first shielding layer covering non-functional surfaces and sidewalls of the semiconductor chips; adhering each electronic device to the carrier plate at a side of a corresponding semiconductor chip; forming a second shielding layer on the first shielding layer; forming a plastic encapsulation layer covering the second shielding layer, the electronic devices that do not need shielding, and the carrier plate; peeling off the carrier plate to form a pre-packaging plate; and forming first external contact structures connected to the first soldering pads and second external contact structures connected to the second soldering pads.