Electronic Package Shielding Structure for Low-Impedance EMI Grounding
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Solution Overview
Problem
Conventional semiconductor packages experience reduced electromagnetic interference (EMI) shielding effectiveness due to an incomplete shielding layer structure around solder balls, increasing impedance and compromising shielding performance.
Innovation Solution
The electronic package design includes conductive structures that ground the shielding layer to the carrier, ensuring quick charge conduction and enhancing EMI shielding, with the shielding layer electrically connected to these structures but not to the conductive components, thereby reducing the grounding path and improving shielding performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the shielding layer is formed to get around the solder balls, then the shielding layer structure is completed, but the impedance of the shielding layer increases and shielding effect is reduced
Solution Approach 1:
The patent introduces conductive structures as intermediary elements between the shielding layer and the carrier. These conductive structures serve as mediators to provide electrical connection and grounding paths, allowing the shielding layer to be electrically connected to the carrier without direct contact through the solder ball areas, thus maintaining low impedance while achieving complete shielding coverage.
Solution Approach 2:
The patent transitions from a two-dimensional planar shielding layer to a three-dimensional shielding structure by adding vertical conductive structures (such as conductive pillars or vias) that extend through the encapsulation layer. This dimensional change allows the shielding layer to be electrically connected to the carrier at multiple levels, providing effective grounding paths without increasing the impedance of the shielding layer itself.
2Object-affected harmful factors
If the shielding layer is formed as an incomplete structure around solder balls, then the impedance is reduced, but the shielding effect is significantly reduced
Solution Approach 1:
The patent segments the shielding structure into multiple functional parts: a shielding layer that provides electromagnetic shielding coverage, and separate conductive structures that provide electrical connection and grounding. This segmentation allows the shielding layer to be formed as a complete continuous structure for effective shielding, while the grounding function is handled by dedicated conductive structures, preventing impedance issues.
3Reliability
If the grounding path is extended, then the shielding coverage is improved, but the charge conduction speed is reduced
Solution Approach 1:
The patent implements preliminary action by pre-establishing multiple vertical conductive structures (such as conductive pillars or plated through-holes) during the packaging process, before final electrical connection is needed. These pre-formed conductive structures provide ready-made low-impedance grounding paths, enabling fast charge conduction when the shielding layer is electrically connected to the carrier, thus improving both shielding coverage and charge conduction speed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively enhances EMI shielding by allowing charges to be quickly conducted through the carrier, reducing the grounding path and improving shielding performance compared to conventional methods.
Implementation Method 1
the shielding layer is electrically connected to the plurality of conductive structures... end surfaces of the plurality of conductive structures are flush with a surface of the encapsulation layer and in contact with the shielding layer
Data Source
AI summary
An electronic package and a method thereof are provided, in which an electronic component, conductive structures and conductive components are disposed on one side of a carrier and electrically connected to the carrier. The electronic component, the conductive structures and the conductive components are encapsulated by an encapsulation layer. A shielding layer is formed on the encapsulation layer to cover the electronic component, where the shielding layer is electrically connected to the conductive structures and free from being electrically connected to the conductive components. A shielding structure is formed to cover the other side of the carrier.