Semiconductor Package Shielding Layer for Compact EMI Protection
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Solution Overview
Problem
Semiconductor package structures face interference issues between electronic components due to lack of effective shielding, leading to performance degradation and manufacturing challenges such as misalignment and increased package size.
Innovation Solution
A semiconductor package structure with a conductive contact and a shielding layer disposed on the lateral surface of electronic components, forming a chip-scale shielding layer that contacts the conductive contact, eliminating the need for alignment and cutting operations, thereby enhancing reliability and reducing package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shielding structure is added to provide shielding effectiveness, then electromagnetic interference protection is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines the shielding layer formation with the existing conductive contact structure by forming the shielding layer to directly contact the conductive contact, merging two functions (shielding and electrical connection) into a single integrated structure, thereby providing EMI protection without significantly increasing device complexity
Solution Approach 2:
The shielding layer is formed in advance during the manufacturing process to directly contact the conductive contact, establishing the shielding connection before final assembly, which simplifies subsequent manufacturing steps and reduces alignment requirements
2Object-affected harmful factors
If alignment and cutting operations are performed to create shielding structures, then shielding effectiveness is improved, but manufacturing precision requirements increase and production time increases
Solution Approach 1:
The shielding layer is designed to self-align and contact the conductive contact through the manufacturing process itself, without requiring separate alignment operations. The layer automatically establishes contact during formation, eliminating the need for precise manual or automated alignment procedures
Solution Approach 2:
The shielding layer is formed in advance with built-in contact capability to the conductive contact, establishing the shielding connection before final assembly, which simplifies subsequent manufacturing steps and reduces alignment requirements
3Object-affected harmful factors
If traditional shielding structures are used, then EMI protection is provided, but package size increases
Solution Approach 1:
The patent merges the shielding layer with the existing package structure by forming it to contact the conductive contact that is already part of the electronic component, integrating the shielding function into the existing package volume rather than adding separate shielding components
Solution Approach 2:
The shielding is implemented as a thin film layer rather than a bulky three-dimensional structure, allowing EMI protection to be achieved with minimal increase in package volume. The thin film nature of the shielding layer enables it to conform to existing structures without requiring additional space
Data Source
AI summary
A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes an electronic component, a conductive contact, and a first shielding layer. The electronic component has a first surface, a lateral surface angled with the first surface, and a second surface opposite to the first surface. The conductive contact is connected to the first surface of the electronic component. The first shielding layer is disposed on the lateral surface of the electronic component and a portion of the first surface of the electronic component. The first shielding layer contacts the conductive contact.