Semiconductor Package Shielding Structure With Sidewall Ground Wire
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Solution Overview
Problem
Conventional semiconductor packaging structures, particularly lead frame packages, face challenges in implementing electromagnetic shielding due to limited space for connecting the ground pin to the shielding layer, restricting the application of conformal shielding to only specific packaging types like BGA and LGA, and even in organic substrates, there are difficulties in routing the ground bonding region to contact the shielding layer.
Innovation Solution
A semiconductor packaging structure that includes a base layer, a die, a molding compound, and a bonding wire with terminals that extend to the side surface of the molding compound, allowing the bonding wire to contact the inner side of the shielding layer, which is formed on the top and side surfaces of the molding compound, enabling effective coupling to the ground pin and enhancing shielding connections across various package types.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conformal shielding is applied to lead frame packages, then EMI protection is improved, but space for connecting ground pin to shielding layer becomes insufficient
Solution Approach 1:
The bonding wire extends vertically from the ground pin through the molding compound to contact the shielding layer, transitioning from a planar connection to a three-dimensional connection. This allows ground connection without requiring additional lateral space on the substrate surface.
Solution Approach 2:
The bonding wire acts as an intermediary element connecting the ground pin inside the chip to the shielding layer outside, enabling EMI shielding functionality without requiring direct planar contact between ground bonding area and shielding layer.
2Object-affected harmful factors
If ground wire is routed on substrate to contact shielding layer, then shielding connection is improved, but substrate edge exposure is required which limits space
Solution Approach 1:
Instead of routing the ground connection laterally across the substrate to the edge, the bonding wire extends vertically through the molding compound to reach the shielding layer, eliminating the need for substrate edge exposure and lateral routing space.
3Object-affected harmful factors
If shielding layer is formed on molding compound, then EMI shielding effectiveness is improved, but manufacturing complexity increases
Solution Approach 1:
The molding compound serves dual functions: as the encapsulating material for the die and as the medium through which the bonding wire reaches the shielding layer. This eliminates the need for separate ground bonding area design and simplifies the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows conformal shielding to be applied to a wider range of packaging structures, including lead frame types like QFN, by ensuring the shielding layer can be effectively connected to the ground pin, thereby enhancing electromagnetic interference (EMI) protection without the need for extensive space on the organic substrate.
Implementation Method 1
a bonding wire contacting a ground signal, wherein the bonding wire has a first terminal and a second terminal, wherein the bonding wire extends to the side surface of the molding compound, such that the first terminal of bonding wire contacts an inner side of the shielding layer
Data Source
AI summary
The present application discloses a semiconductor packaging structure and a manufacturing method of the same that could be commonly used for lead frame products and substrate products. The semiconductor packaging structure includes: a base layer (lead frame or organic substrate); a die, disposed on the base layer; a molding compound, filled over the base layer and surrounding the die; a shielding layer, covering the top surface and a side surface of the molding compound; and a bonding wire, having a first terminal and a second terminal, wherein the bonding wire extends the side surface of the molding compound, thus allowing the first terminal of the bonding wire to contact an inner side of the shielding layer.