Semiconductor Package Shielding Layout for Reduced Keep-Out Zones
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Solution Overview
Problem
Existing techniques for forming an EMI shielding layer on antenna packages, such as Antenna in Package (AiP), face challenges with miniaturization due to the incompatibility of mask dimensions with the keep out zone (KOZ) around conductive pads, leading to increased package size and reduced accuracy in shielding protection.
Innovation Solution
A semiconductor device package design that includes a carrier with a predetermined non-shielding region, where a mask layer is used to cover specific regions, allowing for precise alignment and lamination of a shielding layer over the non-shielding areas, reducing the keep out zone and enabling miniaturization while maintaining effective EMI shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a mask is used to protect conductive pads during EMI shielding layer formation, then the conductive pads are protected from overlapping or being covered by the shielding layer, but the mask dimensions are incompatible with the keep out zone (KOZ) around the conductive pads, leading to increased package size
Solution Approach 1:
The patent divides the shielding layer into multiple segments: a first shielding layer portion formed over the keep out zone and a second shielding layer portion formed over the conductive pads. This segmentation allows different regions to have different shielding characteristics, enabling the KOZ to be reduced while still protecting the conductive pads through the second shielding portion.
Solution Approach 2:
The patent applies different shielding properties to different regions: the first shielding layer portion provides EMI shielding over the KOZ area, while the second shielding layer portion provides additional protection specifically over the conductive pads. This local differentiation allows optimization of each region's shielding characteristics without requiring a uniform large mask.
2Reliability
If a mask is used to protect conductive pads, then the conductive pads are protected from overlapping or being covered by the EMI shielding layer, but the mask dimensions are incompatible with the keep out zone (KOZ) around the conductive pads, leading to reduced accuracy in shielding protection
Solution Approach 1:
The shielding layer is segmented into two distinct portions with different functions: the first portion addresses EMI shielding for the KOZ region, while the second portion provides precise protection for the conductive pads. This segmentation enables accurate shielding protection without requiring an oversized mask that would compromise precision.
Solution Approach 2:
The patent forms the first shielding layer portion over the KOZ region before forming the second shielding layer portion over the conductive pads. This preliminary action establishes the basic EMI shielding framework, allowing subsequent precise positioning of the second shielding portion to accurately protect the conductive pads without interference from mask dimension constraints.
Data Source
AI summary
The present disclosure provides a semiconductor device package including a carrier, an electronic component, and a shielding layer. The carrier includes a predetermined non-shielding region. The electronic component is disposed over the predetermined non-shielding region. The shielding layer includes a first portion disposed over the predetermined non-shielding region.